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公开(公告)号：SE446197B
公开(公告)日：1986-08-18
申请号：SE7803186
申请日：1978-03-20
Applicant: KOLLMORGEN TECH CORP
Abstract: Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided.
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公开(公告)号：SE7803186A
公开(公告)日：1978-09-24
申请号：SE7803186
申请日：1978-03-20
Applicant: KOLLMORGEN TECH CORP
CPC classification number: C25B3/12 , C23C18/1619 , C23C18/1653 , C23C18/1669 , C23C18/1671
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公开(公告)号：AU519455B2
公开(公告)日：1981-12-03
申请号：AU3469878
申请日：1978-04-03
Applicant: KOLLMORGEN TECH CORP
Abstract: Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided.
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公开(公告)号：SE456388B
公开(公告)日：1988-09-26
申请号：SE8100733
申请日：1981-01-30
Applicant: KOLLMORGEN TECH CORP
Abstract: A method for producing circuit boards in which a plurality of planar circuit board bases having a circuit pattern thereon are interconnected at predetermined points. The method includes the steps of applying a mask over the circuit pattern on a base leaving, at the points to be interconnected, a window in the mask; applying an adhesive coating over the mask with the adhesive coating extending over the mask windows and onto the circuit pattern metal to form a second smaller window; treating and depositing metal on said adhesive coating to form a second circuit pattern on the plane of said adhesive and interconnecting the second circuit pattern with the first circuit pattern at said second windows; and, repeating said steps until a circuit board of the desired number of planar circuit patterns is produced.
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Patent Agency Ranking
公开(公告)号：SE428987B
公开(公告)日：1983-08-01
申请号：SE7803187
申请日：1978-03-20
Applicant: KOLLMORGEN TECH CORP
Inventor： STAHL F
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公开(公告)号：DK130878A
公开(公告)日：1978-09-24
申请号：DK130878
申请日：1978-03-22
Applicant: KOLLMORGEN TECH CORP
Abstract: Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided.
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公开(公告)号：BR7801802A
公开(公告)日：1979-01-23
申请号：BR7801802
申请日：1978-03-22
Applicant: KOLLMORGEN TECH CORP
Abstract: Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided.
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