公开(公告)号：EP2057867A4

公开(公告)日：2014-01-01

申请号：EP07800465

申请日：2007-08-22

Applicant: KONINKL PHILIPS NV

Inventor： MATHESON GEORGE E

IPC: H05B37/02 ,  F21V8/00

CPC classification number: H05B33/0869 ,  F21K9/00 ,  F21V23/0442 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0214 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0474 ,  G01J1/32 ,  G01J2001/4247 ,  G02B6/0036 ,  G02B6/0038 ,  G02B6/0043 ,  G02B6/0058 ,  H05B33/0803 ,  H05B37/0218 ,  Y02B20/46

公开(公告)号：EP1891671A4

公开(公告)日：2013-12-18

申请号：EP06741539

申请日：2006-05-19

Applicant: KONINKL PHILIPS NV

Inventor： MATHESON GEORGE E

IPC: F21V29/00 ,  F21V5/04 ,  F21V15/01 ,  F21V17/16 ,  F21V19/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/483 ,  F21V5/00 ,  F21V5/002 ,  F21V5/045 ,  F21V15/01 ,  F21V19/003 ,  F21V21/002 ,  F21V21/08 ,  F21V29/004 ,  F21V29/006 ,  F21V29/74 ,  F21V29/763 ,  F21V31/04 ,  F21Y2115/10 ,  H01L33/62 ,  H01L33/645 ,  H01L33/648 ,  H01L51/529 ,  H01L2224/48091 ,  H01R12/675 ,  H01R13/50 ,  H01R13/6658 ,  H01R13/7175 ,  H01R25/14 ,  H01L2924/00014

Abstract: The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.

Abstract translation: 根据本发明的发光模块包括散热元件，例如金属芯印刷电路板（MCPCB）的基板，或耦合到一个或多个发光元件的FR4板，并提供用于操作 将发光元件连接到电源。 衬底被定位成使得其热耦合到散热元件。 发光模块还包括与散热元件配合连接的壳体元件，其中壳体元件还可以包括集成在其中的光学元件，用于操纵由一个或多个发光元件产生的光。