公开(公告)号：WO2013051809A3

公开(公告)日：2013-06-06

申请号：PCT/KR2012007722

申请日：2012-09-25

Applicant: KOREA AEROSPACE RES INST

Inventor： CHOI IK HYEON ,  LIM CHEOL HO ,  SIM EUN SUP

IPC: B32B3/06 ,  B29C65/00 ,  B32B7/08 ,  B32B37/00

CPC classification number: B29C65/564 ,  B29C66/112 ,  B29C66/1122 ,  B29C66/131 ,  B29C66/301 ,  B29C66/43 ,  B29C66/474 ,  B29C66/524 ,  B29C66/52441 ,  B29C66/721 ,  B29C66/72141 ,  B29C66/81455 ,  B29C66/8322 ,  B29C70/24 ,  B29L2031/30 ,  B32B3/06 ,  B32B7/08

Abstract: The objective of the present invention is to provide a Z-pin patch and a method for manufacturing or coupling a composite laminated structure using same. According to the present invention, the Z-pinning of a composite structure may be achieved using a maximally simplified structure to improve process efficiency and productivity. The Z-pin patch according to the present invention may be a Z-pin patch (30) which is used for Z-pinning for reinforcing the interlayer performance of a composite laminated structure or for contacting and connecting a plurality of laminated members together. The Z-pin patch includes: a base plate (31) having a plate shape; and a plurality of pins (32) fixed to one side of the base plate (31).

Abstract translation: 本发明的目的是提供一种Z形贴片以及使用其制造或耦合复合叠层结构的方法。 根据本发明，可以使用最大简化的结构来实现复合结构的Z钉扎，以提高工艺效率和生产率。 根据本发明的Z形针片可以是Z形针片（30），其用于Z形钉扎，以增强复合层压结构的层间性能或者将多个层压构件接触并连接在一起。 Z形贴片包括：具有板形的基板（31）; 以及固定在所述基板（31）的一侧的多个销（32）。