公开(公告)号：WO2010123314A2

公开(公告)日：2010-10-28

申请号：PCT/KR2010002567

申请日：2010-04-23

Applicant: KOREA IND TECH INST ,  CHUN HYUN-AEE ,  SHIN SEUNG-HAN ,  KIM HYUN-AH ,  OH CHANG-HO ,  KIM YUN-JU ,  TAK SANG-YONG ,  LEE MYONG-HOON ,  KANG TAE-YUN

Inventor： CHUN HYUN-AEE ,  SHIN SEUNG-HAN ,  KIM HYUN-AH ,  OH CHANG-HO ,  KIM YUN-JU ,  TAK SANG-YONG ,  LEE MYONG-HOON ,  KANG TAE-YUN

IPC: C08G59/14 ,  C08K3/00 ,  C08K7/02 ,  C08L63/00 ,  H01L29/786

CPC classification number: C08G59/1438 ,  C08G59/5033 ,  C08L63/10

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processibility, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract translation: 本发明涉及一种具有改善的耐热性，热膨胀性和加工性的新型环氧树脂以及包含该环氧树脂的热固性树脂组合物。 为此，本发明提供了一种如说明书中所公开的化学式1的环氧树脂，包含该环氧树脂的环氧树脂组合物，以及由其形成的包装，基材和晶体管。 当包含根据本发明的具有特定侧面官能团的环氧树脂和/或具有特定芯结构的环氧树脂的组合物固化时，填料与环氧树脂形成强烈的化学键，从而最大化填充效果 环氧树脂填料。 此外，通过具体的芯结构，固化产物的耐热性和热膨胀性能得到显着改善（CTE降低），并且证明了增强的玻璃化转变性能，强度和加工性能。

公开(公告)号：WO2015133840A3

公开(公告)日：2015-10-29

申请号：PCT/KR2015002138

申请日：2015-03-05

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  KIM YUN-JU ,  TAK SANG-YONG ,  PARK SU-JIN ,  PARK SOOK-YEON ,  PARK SUNG-HWAN

IPC: C07F7/18 ,  C07D303/12 ,  C09D183/06 ,  C09J183/06

CPC classification number: C07D303/12 ,  C07D303/18 ,  C07F7/1836 ,  C08G77/14 ,  C09D183/06 ,  C09J183/06

Abstract: The present invention relates to a novel epoxy compound having a spacer between a core and an alkoxysilyl group, a method for preparing the same, a composition comprising the same, a cured product, and a use thereof. The epoxy compound exhibits excellent heat-resistant characteristics, particularly a low coefficient of thermal expansion and a high glass transition temperature (which includes Tg-less which does not exhibit glass transition temperature), and an improved brittleness in a composite and/or excellent flame retardant characteristics in a cured product. The present invention provides: an epoxy compound having an alkoxysilyl group which has passed through a spacer group which has at least two epoxy groups, at least one alkoxysilyl group, and a predetermined number of hydrogen, hydroxy groups and/or alkenyl groups; a method for preparing the epoxy compound by means of a step of introducing a spacer group and an epoxy group and an alkoxysilylation step; a method for preparing the epoxy compound by means of a step of introducing a spacer group and an epoxy group, an alkenylation step and an alkoxysilylation step; a composition comprising the epoxy compound; and a cured product and a use thereof. The epoxy composition comprising an epoxy compound having an alkoxysilyl group which has passed through a spacer group according to the present invention exhibits enhanced heat-resistant characteristics, i.e. effects of reducing CTE, increasing glass transition temperature or exhibiting no glass transition temperature (hereinafter referred to as 'Tg less') in a composite. Furthermore, the epoxy composition exhibits improved brittleness. In addition, the cured product of the epoxy composition comprising the epoxy compound having an alkoxysilyl group which has passed through a spacer group according to the present invention exhibits excellent flame retardant characteristics due to introduction of the alkoxysilyl group.

Abstract translation: 本发明涉及一种在核心和烷氧基甲硅烷基之间具有间隔基的新的环氧化合物，其制备方法，包含其的组合物，固化产物及其用途。 环氧化合物表现出优异的耐热特性，特别是低热膨胀系数和高玻璃化转变温度（其包括不显示玻璃化转变温度的Tg），以及复合材料和/或优异的火焰中改善的脆性 固化产物中的阻燃特性。 本发明提供：具有烷氧基甲硅烷基的环氧化合物，其通过具有至少两个环氧基，至少一个烷氧基甲硅烷基和预定数量的氢，羟基和/或烯基的间隔基; 通过引入间隔基和环氧基和烷氧基甲硅烷基化步骤的步骤制备环氧化合物的方法; 通过引入间隔基和环氧基的步骤制备环氧化合物的方法，烯基化步骤和烷氧基硅烷化步骤; 包含环氧化合物的组合物; 和固化产物及其用途。 包含通过本发明的间隔基团的具有烷氧基甲硅烷基的环氧化合物的环氧组合物具有增强的耐热特性，即降低CTE，增加玻璃化转变温度或不显示玻璃化转变温度的作用（以下称为 作为“Tg较少”）。 此外，环氧组合物显示出改善的脆性。 此外，包含通过本发明的间隔基的具有烷氧基甲硅烷基的环氧化合物的环氧组合物的固化产物由于引入烷氧基甲硅烷基而显示出优异的阻燃特性。

公开(公告)号：WO2013028045A3

公开(公告)日：2013-05-10

申请号：PCT/KR2012006832

申请日：2012-08-27

Applicant: KOREA IND TECH INST ,  CHUN HYUN-AEE ,  TAK SANG-YONG ,  PARK SU-JIN ,  KIM YUN-JU ,  PARK SUNG-HWAN

Inventor： CHUN HYUN-AEE ,  TAK SANG-YONG ,  PARK SU-JIN ,  KIM YUN-JU ,  PARK SUNG-HWAN

IPC: C07D407/12 ,  C07D303/12 ,  C07F7/08 ,  C08L63/02

CPC classification number: C08G59/306 ,  C07D303/12 ,  C07D407/12 ,  C07F7/1804 ,  C07F7/1836 ,  C07F7/1876 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K7/14 ,  C08L63/00

Abstract: The present invention relates to an epoxy compound having an alkoxysilyl group, a method for preparing same, a composition and cured material comprising same, and usage thereof. A composite comprising the epoxy compound exhibits superior heat-resistant characteristics, or more specifically, the composite has a low coefficient of thermal expansion (CFE) and a high glass transition temperature or is Tg-less, and/or a cured material comprising the epoxy compound exhibits flame retardant properties and obviates the need for a separate silane coupling agent. The present invention provides: an epoxy compound having an alkoxysilyl group having, in a core, at least one substituent group of the chemical formula S1, and at least two epoxy groups; a method for preparing the epoxy compound by means of allylation of a starting material, Claisen rearrangement, glycidylation, and alkoxysilylation; an epoxy composition comprising the epoxy compound; and cured material of the compound and usage thereof. The novel composite of a composition comprising the epoxy compound having an alkoxysilyl group enhances chemical bonding, within the epoxy compound, of the alkoxysilyl group and filler, and additionally enhances the chemical bonding efficiency during the formation of the epoxy composite, which is due to the chemical bonding between the alkoxysilyl groups of the epoxy compound having an alkoxysilyl group. Accordingly, the composite exhibits superior heat-resistant characteristics, that is, the composite has a low CTE and a high glass transition temperature or is Tg-less. Additionally, the cured material resulting from the composition comprising the epoxy composition exhibits superior flame-retardant characteristics.

Abstract translation: 本发明涉及具有烷氧基甲硅烷基的环氧化合物，其制备方法，组合物和包含该组合物的固化材料及其用途。 包含环氧化合物的复合材料表现出优异的耐热特性，或者更具体地说，该复合材料具有低的热膨胀系数（CFE）和高的玻璃化转变温度或不低于Tg，和/或包含环氧树脂的固化材料 化合物具有阻燃性能，并且不需要单独的硅烷偶联剂。 本发明提供：具有烷氧基甲硅烷基的环氧化合物，其具有在核心中至少一个具有化学式S1的取代基和至少两个环氧基的烷氧基甲硅烷基; 通过起始原料的烯丙基化，Claisen重排，缩水甘油基化和烷氧基硅烷化制备环氧化合物的方法; 包含环氧化合物的环氧组合物; 化合物的固化物及其用途。 包含具有烷氧基甲硅烷基的环氧化合物的组合物的新型复合物增强了环氧化合物内的烷氧基甲硅烷基和填料的化学键合，并且还增加了形成环氧复合材料期间的化学键合效率，这是由于 具有烷氧基甲硅烷基的环氧化合物的烷氧基甲硅烷基之间的化学键合。 因此，复合材料具有优异的耐热特性，即复合材料具有低的CTE和高的玻璃化转变温度，或者不含Tg。 此外，由包含环氧组合物的组合物得到的固化材料表现出优异的阻燃特性。

公开(公告)号：EP2871182A4

公开(公告)日：2016-03-16

申请号：EP13813009

申请日：2013-07-05

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  KIM YUN-JU ,  TAK SANG-YONG ,  PARK SU-JIN ,  PARK SUNG-HWAN

IPC: C07D303/04 ,  C07F7/18 ,  C08G59/08 ,  C08G59/14 ,  C08G59/18 ,  C08L63/04

CPC classification number: C08G59/1494 ,  C07D303/04 ,  C07F7/1836 ,  C08G59/08 ,  C08G59/1433 ,  C08K3/36 ,  C08K7/14 ,  C08L63/04 ,  C08L2205/02

公开(公告)号：EP3093304A4

公开(公告)日：2017-08-02

申请号：EP15735456

申请日：2015-01-09

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  KIM YUN-JU ,  PARK SU-JIN ,  PARK SOOK-YEON ,  TAK SANG-YONG ,  PARK SUNG-HWAN

IPC: C08G59/40 ,  C08G8/28 ,  C08G59/62 ,  C08K5/04 ,  C08K5/54 ,  C08L63/04

CPC classification number: C08G59/4085 ,  B32B27/42 ,  C08G8/28 ,  C08G14/12 ,  C08G59/40 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08K5/54 ,  C08K7/14 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C09D161/14 ,  C09D161/34 ,  C09D163/04 ,  C09J161/14 ,  C09J161/34 ,  C09J163/04 ,  H01L23/29 ,  H01L23/293 ,  H05K1/0353

Abstract: The present invention relates to a novolac hardener having an alkoxysilyl group, the novolac hardener exhibiting excellent heat resistance characteristics, such as a low coefficient of thermal expansion (CTE) and an increase in the glass transition temperature, when forming a composite; a method for preparing the same; a composition containing the same; a hardened product; and a use thereof. According to an embodiment of the present invention, provided are a novolac hardener having an alkoxysilyl group of chemical formulas I-1 to I-4; a method for preparing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to 1-4 through alkenylation and alkoxysilylation of the novolac hardener; a method for preparing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to 1-4 through alkoxysilylation of the novolac hardener; a composition containing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to I-4; a hardened product thereof; and a use thereof. A composite comprising the novel hardener having an alkoxysilyl group according to the present invention exhibits a low CTE and a high glass transition temperature through a chemical bond between the alkoxysilyl group of the hardener and a phenol or epoxide group as well as a chemical bond between the alkoxysilyl group of the hardener and a filler.

Abstract translation: 本发明涉及具有烷氧基甲硅烷基的酚醛清漆硬化剂，所述酚醛清漆硬化剂在形成复合材料时表现出优异的耐热性（例如低热膨胀系数（CTE）和玻璃化转变温度的增加）; 其制备方法; 含有该组合物的组合物; 硬化产品; 及其用途。 根据本发明的一个实施方案，提供了具有化学式I-1至I-4的烷氧基甲硅烷基的酚醛清漆硬化剂; 通过酚醛清漆硬化剂的烯基化和烷氧基甲硅烷基化来制备具有化学式I-1至1-4的烷氧基甲硅烷基的酚醛清漆硬化剂的方法; 通过酚醛清漆硬化剂的烷氧基甲硅烷基化来制备具有化学式I-1至1-4的烷氧基甲硅烷基的酚醛清漆硬化剂的方法; 包含具有化学式I-1至I-4的烷氧基甲硅烷基的酚醛清漆硬化剂的组合物; 其硬化产物; 及其用途。 根据本发明的包含具有烷氧基甲硅烷基的新型硬化剂的复合材料通过硬化剂的烷氧基甲硅烷基与苯酚或环氧基之间的化学键以及在所述硬化剂之间的化学键显示低CTE和高玻璃化转变温度 硬化剂的烷氧基甲硅烷基和填料。

公开(公告)号：EP2835373A4

公开(公告)日：2015-11-18

申请号：EP13772355

申请日：2013-04-02

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  PARK SU-JIN ,  TAK SANG-YONG ,  KIM YUN-JU ,  PARK SOOK-YEON ,  PARK SUNG-HWAN

IPC: C07D303/26 ,  C07D303/28 ,  C07F7/18 ,  C08G59/22

CPC classification number: C08G59/306 ,  C07D303/26 ,  C07D303/28 ,  C07F7/1804 ,  C07F7/1836 ,  C08G59/22 ,  C08G59/3281 ,  C08G59/38 ,  C08K7/14

Abstract: The present invention relates to: an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a synergistic effect in a composite material; a composition and a cured article comprising same; a use for same; and a production method for an epoxy compound having an alkoxysilyl group. Accordingly, the present invention provides: an epoxy compound having an epoxy group and an alkoxysilyl group; and a composition comprising the epoxy compound together with a curing agent, a filler and/or a reaction catalyst or the like, and various uses for same including in a cured article and electronic components. According to the present invention, the novel epoxy composition comprising the epoxy compound having the alkoxysilyl group exhibits improved heat resistance, which is to say an effect whereby the CTE of the epoxy composite is reduced and whereby the glass transition temperature is elevated or a glass transition temperature is not exhibited (referred to hereinbelow as "Tg less"), because of chemical bond formation due to a chemical reaction of the alkoxysilyl group and the filler (fibres and/or particles) and a chemical reaction between alkoxysilyl groups, in the composite material and/or the cured article. Moreover, the cured article comprising the epoxy compound having the alkoxysilyl group according to the present invention exhibits outstanding flame retardancy due to the inclusion of the alkoxysilyl group.

公开(公告)号：EP2826777A4

公开(公告)日：2015-11-25

申请号：EP13760819

申请日：2013-03-14

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  KIM YUN-JU ,  PARK SU-JIN ,  PARK SOOK-YEON ,  PARK SUNG-HWAN ,  TAK SANG-YONG

IPC: C07D407/10 ,  C07D407/12 ,  C08L63/00

CPC classification number: C08G59/3281 ,  C07D303/36 ,  C07F7/1836 ,  C07F7/1876 ,  C08G59/04 ,  C08G59/306 ,  C08K3/36 ,  C08K7/14 ,  C08L63/00 ,  C09D163/00

Abstract: The present invention relates to an alkoxy silyl-based epoxy compound exhibiting excellent heat resistant characteristics in a composite, and more particularly, exhibiting a low coefficient of thermal expansion (CTE) and the effect of significantly increasing the glass transition temperature in a composite and eliminating the necessity of a separate silane coupling agent. The present invention also relates to a composition comprising the compound, to a cured product thereof, to the use thereof and to a method for preparing an epoxy compound comprising an alkoxy silyl group. Thus, according to the present invention, provided are an epoxy compound comprising an epoxy group and an alkoxy silyl group, a composition comprising the epoxy compound and a curing agent, a filler and/or a reaction catalyst, a cured product thereof and the use thereof such as in an electronic component or the like. The epoxy composition comprising an epoxy compound having a novel alkoxy silyl group according to the present invention is obtained by a chemical bond resulting from a chemical reaction between the alkoxy silyl group and a filler (fiber and/or particle) and a chemical reaction between alkoxy silyl groups in a composite and/or a cured product, thus exhibiting effects of improved heat resistant characteristics, that is, a lower CTE and a higher glass transition temperature or no glass transition temperature (hereinafter, referred to as 'Tg-less') in an epoxy composite. Furthermore, the cured product comprising an epoxy compound having an alkoxy silyl group according to the present invention exhibits excellent flame resistance by introducing the alkoxy silyl group thereto.

公开(公告)号：EP2767535A4

公开(公告)日：2015-02-18

申请号：EP12826044

申请日：2012-08-27

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  TAK SANG-YONG ,  PARK SU-JIN ,  KIM YUN-JU ,  PARK SUNG-HWAN

IPC: C07F7/18 ,  C08G59/30 ,  C08L63/02

CPC classification number: C08G59/306 ,  C07D303/12 ,  C07D407/12 ,  C07F7/1804 ,  C07F7/1836 ,  C07F7/1876 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K7/14 ,  C08L63/00

Abstract: Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, a cured product of the composition and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, a glycidylation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, a cured product of the composition and a use of the composition are provided. The composite of the composition comprising the alkoxysilylated epoxy compound exhibits improved chemical bonding,-good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less via the enhanced chemical bonding efficiency of alkoxysilyl group. The cured product of the composition exhibits good flame retardant properties.

公开(公告)号：EP2960245A4

公开(公告)日：2016-10-05

申请号：EP14754737

申请日：2014-02-25

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  PARK SUNG-HWAN ,  KIM YUN-JU ,  PARK SU-JIN ,  PARK SOOK-YEON ,  TAK SANG-YONG

IPC: C07F1/08 ,  C07F7/10 ,  C09J163/00

CPC classification number: C08G59/02 ,  C07D303/12 ,  C07D303/36 ,  C07D405/06 ,  C07F7/1836 ,  C08G59/06 ,  C08G59/306 ,  C08L63/00 ,  C09D163/00 ,  C09J163/00 ,  Y10T428/239

Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.

Abstract translation: 提供的是在烷氧基甲硅烷环氧化合物，复合材料，其中显示出良好的耐热性，低的CTE并提高玻璃化转变温度，并且其固化物表现出良好的阻燃性，而不需要单独的偶联剂，制备方法相同的和的组合物和 固化的产品，包括相同。 在烷氧基甲硅烷的环氧化合物包括环氧基团和在选自式S11选择为S15或选自式S21中选择到S25 S2 S1的取代基的取代基的至少一个烷氧基硅烷基的的; 为通过开始对环氧组合物包括环氧化合物，和固化的产物和使用该组合物的材料和alkoxysilylation的环氧基开环反应来制备其的方法，提供了。 由于化学键可以烷氧基硅烷基和烷氧基甲硅烷的填料组之间和之间形成，该复合材料的化学结合效率可以提高。

公开(公告)号：EP2933257A4

公开(公告)日：2016-07-13

申请号：EP13837901

申请日：2013-09-17

Applicant: KOREA IND TECH INST

Inventor： CHUN HYUN-AEE ,  KIM YUN-JU ,  PARK SU-JIN ,  TAK SANG-YONG ,  PARK SUNG-HWAN ,  KANG KYUNG-NAM ,  PARK SOOK-YEON

IPC: C07F7/18 ,  C08K7/14

CPC classification number: C08L63/00 ,  C07F7/1836 ,  C08G59/306 ,  C08G59/3281 ,  C08K5/50 ,  C08K7/14