公开(公告)号：US20240043732A1

公开(公告)日：2024-02-08

申请号：US18360963

申请日：2023-07-28

Applicant: KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY

Inventor： Seung Hyup Lee ,  Gyeong Ho Yun ,  Yun Jin Kim ,  Su Hyeon Cho ,  Min Ho Nam

IPC: C09K5/14

CPC classification number: C09K5/14

Abstract: A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for conduction of thermal energy between a heat generation part and a heat absorption part.