公开(公告)号：US11801494B2

公开(公告)日：2023-10-31

申请号：US17271206

申请日：2019-11-06

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sukang Bae ,  Seoung-Ki Lee ,  Dae-Young Jeon ,  Myung Jong Kim ,  Nam Dong Kim

IPC: B01J23/75 ,  B01J23/755 ,  B01J21/02 ,  B01J21/18 ,  B01J23/46 ,  B01J23/745 ,  B01J27/02 ,  B01J27/14 ,  B01J37/02

CPC classification number: B01J23/755 ,  B01J21/02 ,  B01J21/18 ,  B01J23/464 ,  B01J23/468 ,  B01J23/745 ,  B01J23/75 ,  B01J27/02 ,  B01J27/14 ,  B01J37/0215

Abstract: Provided is a method for manufacturing a single-atom catalyst supported on a carbon support, including treating a mixture of a precursor of a carbon support and a precursor of a hetero element other than carbon through a dry vapor phase process, thereby supporting, on a carbon support, a single-atom catalyst containing a hetero element other than carbon.

公开(公告)号：US10915024B2

公开(公告)日：2021-02-09

申请号：US16032585

申请日：2018-07-11

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sunbin Hwang ,  Dong Su Lee ,  Dae-Young Jeon ,  Sukang Bae ,  Seoung-Ki Lee ,  Sang Hyun Lee ,  Tae-Wook Kim

IPC: G03F7/20 ,  G03F7/24 ,  G03F7/00 ,  B32B5/00 ,  H01L21/027

Abstract: A fiber-type electronic device comprising a pattern for electronic devices stacked on a fiber filament substrate is provided. It is possible to manufacture an electronic device directly on a fiber filament substrate by applying the pattern for electronic devices. Thus, it can be widely used for wearable devices and the like. The pattern for electronic devices is manufactured by a method for forming a pattern for electronic devices comprising an exposure process using a maskless exposure apparatus. Thus, it is possible to manufacture a pattern for electronic devices on a fiber filament substrate through a continuous process and thus to increase the process efficiency.