公开(公告)号：US09541377B1

公开(公告)日：2017-01-10

申请号：US14936275

申请日：2015-11-09

Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE

Inventor： Dae-Su Yee ,  Ji Sang Yahng

IPC: G01B11/06

CPC classification number: G01B11/06 ,  G01B9/02003 ,  G01B9/02004 ,  G01B9/02084 ,  G01S7/4802 ,  G01S17/325

Abstract: Provided is an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, and more particularly, an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, which is capable of measuring a thickness of a sample by irradiating a terahertz continuous wave, which is generated from a wavelength-fixed laser and a wavelength-swept laser and of which the frequency is changed at a high speed, to the sample and measuring the terahertz wave transmitting or reflected from the sample.

Abstract translation: 提供了一种使用太赫兹波的实时非接触非破坏性厚度测量的装置，更具体地，涉及一种使用太赫兹波进行实时非接触非破坏性厚度测量的装置，其能够测量 通过将从波长固定的激光器和波长扫描的激光器产生的并且频率被高速变化的太赫兹连续波照射到样品并测量透射或反射的太赫兹波来测量样品的厚度 例子。

公开(公告)号：US10222204B2

公开(公告)日：2019-03-05

申请号：US15291630

申请日：2016-10-12

Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE

Inventor： Ji Sang Yahng ,  Dae-Su Yee

IPC: G01B11/25 ,  G01B11/24 ,  G02B13/00 ,  G02B26/10 ,  G02B27/10 ,  G01N21/3586

Abstract: Provided is a high-speed 3D imaging system using continuous-wave THz beam scan, and more particularly, a high-speed 3D imaging system using continuous-wave THz beam scan capable of acquiring a 3D image for a sample at a high speed and high precision by measuring a signal reflected from a sample using the continuous-wave THz beam generated from a wavelength-fixed laser and a wavelength-swept laser and having a frequency varying at a high speed to obtain depth direction information on a sample and performing a 2D scan on the sample using a THz beam scanner.

公开(公告)号：US20170003116A1

公开(公告)日：2017-01-05

申请号：US14936275

申请日：2015-11-09

Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE

Inventor： Dae-Su Yee ,  Ji Sang Yahng

IPC: G01B11/06

CPC classification number: G01B11/06 ,  G01B9/02003 ,  G01B9/02004 ,  G01B9/02084 ,  G01S7/4802 ,  G01S17/325

Abstract: Provided is an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, and more particularly, an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, which is capable of measuring a thickness of a sample by irradiating a terahertz continuous wave, which is generated from a wavelength-fixed laser and a wavelength-swept laser and of which the frequency is changed at a high speed, to the sample and measuring the terahertz wave transmitting or reflected from the sample.

Abstract translation: 提供了一种使用太赫兹波的实时非接触非破坏性厚度测量的装置，更具体地，涉及一种使用太赫兹波进行实时非接触非破坏性厚度测量的装置，其能够测量 通过将从波长固定的激光器和波长扫描的激光器产生的并且频率被高速变化的太赫兹连续波照射到样品并测量透射或反射的太赫兹波来测量样品的厚度 例子。