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公开(公告)号:US10466031B2
公开(公告)日:2019-11-05
申请号:US15538846
申请日:2016-08-26
Inventor: Young-Sik Ghim , Hyug-Gyo Rhee , Yun Woo Lee
Abstract: The present disclosure relates to an apparatus for measuring a thickness and a surface profile of a multilayered film structure using an imaging spectral optical system and a measuring method. More specifically, the present disclosure relates to a method and an apparatus which measure a thickness and a surface profile of a multilayered thin film structure by applying a method for obtaining an absolute reflectance value for an object to be measured having a multilayered thin film using a reflected light measuring method and extracting a phase from an interference signal with a reference mirror using a phase shift algorithm.
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公开(公告)号:US09863814B2
公开(公告)日:2018-01-09
申请号:US14318003
申请日:2014-06-27
Inventor: Hyug-Gyo Rhee , Young Sik Ghim , Ho Soon Yang , Yun Woo Lee
CPC classification number: G01J9/0215 , G01J2009/002
Abstract: Provided is an operating method of a measuring apparatus measuring a wavefront of a target. The operating method includes measuring a measurement wavefront on the basis of the wavefront of the target, measuring reference slope information and first to third slope information respectively corresponding to a reference direction and first to third directions on the basis of the measurement wavefront, obtaining first to third rotation angles on the basis of the measured reference slope information and first to third slope information, and outputting a wavefront of which an error is corrected, which is generated by rotation errors on the basis of the obtained first to third rotation angles, wherein the first to third rotation angles are differences in angle between the reference direction and the first to third directions.
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