公开(公告)号：US11874070B2

公开(公告)日：2024-01-16

申请号：US17772800

申请日：2020-11-25

Applicant: Khalifa University of Science and Technology

Inventor： Rashid K. Abu Al-Rub ,  Oraib Al-Ketan

IPC: F28F13/00 ,  F28D7/08

CPC classification number: F28D7/08 ,  F28F13/003 ,  F28F2210/02 ,  F28F2255/00

Abstract: Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.

公开(公告)号：US11828541B2

公开(公告)日：2023-11-28

申请号：US17772800

申请日：2020-11-25

Applicant: Khalifa University of Science and Technology

Inventor： Rashid K. Abu Al-Rub ,  Oraib Al-Ketan

IPC: F28F13/00 ,  F28D7/08

CPC classification number: F28D7/08 ,  F28F13/003 ,  F28F2210/02 ,  F28F2255/00

Abstract: Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.