公开(公告)号：US20200136233A1

公开(公告)日：2020-04-30

申请号：US16175807

申请日：2018-10-30

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao LIN ,  Yung-Lin CHIA ,  Chiao-Cheng CHANG

IPC: H01Q1/22 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01Q1/52

Abstract: An antenna carrier plate structure has a first circuit board and a second circuit board. The first circuit board has a first substrate and a conductive connector disposed in the first substrate. The conductive connector has two opposite connecting ends respectively protruding from two opposite surfaces of the first substrate. The second circuit board has a second substrate formed with a through hole, and a connecting plug is disposed in the through hole. One end of the connecting plug is formed with an engaging concave portion for engaging one end of the conductive connector of the first substrate. Therefore, each circuit board can be firmly fixed and electrically connected by engaging to form a multi-layer circuit board module, thereby avoiding joint tolerances during soldering and ensuring a correct connection of the joints.