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    SPECTROSCOPIC BEAM PROFILE OVERLAY METROLOGY
    1.
    发明申请
    SPECTROSCOPIC BEAM PROFILE OVERLAY METROLOGY 审中-公开
    光谱波束剖面覆盖度计

    公开(公告)号：WO2017053581A1

    公开(公告)日：2017-03-30

    申请号：PCT/US2016/053136

    申请日：2016-09-22

    Applicant: KLA-TENCOR CORPORATION

    Inventor： FU, Jiyou ,  SAPIENS, Noam ,  PETERLINZ, Kevin A. ,  PANDEV, Stilian Ivanov

    IPC: G03F7/20 ,  G03F9/00 ,  H01L21/66

    CPC classification number: G03F9/7065 ,  G03F7/70633 ,  G03F9/7046

    Abstract: A spectroscopic beam profile metrology system simultaneously detects measurement signals over a large wavelength range and a large range of angles of incidence (AOI). In one aspect, a multiple wavelength illumination beam is reshaped to a narrow line shaped beam of light that is projected onto an overlay metrology target such that the direction of the line shaped beam is aligned with the direction of extent of a grating structure of the overlay metrology target. Collected light is dispersed across a detector according to AOI in one direction and according to wavelength in another direction. The measured signal at each detector pixel is associated with a particular AOI and wavelength. The collected light includes first order diffracted light, zero order diffracted light, or a combination thereof. In some embodiments, first order diffracted light and zero order diffracted light are detected over separate areas of the detector.

    Abstract translation: 分光光束分布测量系统同时检测大波长范围和大范围入射角（AOI）的测量信号。 在一个方面，将多波长照明光束重新形成为投影到覆盖计量目标上的窄线形的光束，使得线状光束的方向与覆盖层的光栅结构的范围的方向对准 计量目标。 收集的光在一个方向上根据AOI在根据另一方向的波长的情况下分散在检测器上。 每个检测器像素处的测量信号与特定的AOI和波长相关联。 所收集的光包括一级衍射光，零级衍射光或其组合。 在一些实施例中，在检测器的不同区域上检测一级衍射光和零级衍射光。

    OPTICAL METROLOGY WITH SMALL ILLUMINATION SPOT SIZE
    2.
    发明申请
    OPTICAL METROLOGY WITH SMALL ILLUMINATION SPOT SIZE 审中-公开
    具有小照明尺寸的光学计量学

    公开(公告)号：WO2016183031A1

    公开(公告)日：2016-11-17

    申请号：PCT/US2016/031526

    申请日：2016-05-09

    Applicant: KLA-TENCOR CORPORATION

    Inventor： SAPIENS, Noam ,  PETERLINZ, Kevin A. ,  BUETTNER, Alexander ,  PURRUCKER, Kerstin ,  SHCHEGROV, Andrei V.

    IPC: G01N21/956

    CPC classification number: G01B11/24 ,  G01B2210/56 ,  G01N21/956 ,  G01N2021/213 ,  G03F7/70625

    Abstract: Methods and systems are presented to reduce the illumination spot size projected onto a measurement target and associated spillover onto area surrounding a measurement target. In one aspect, a spatial light modulator (SLM) is located in the illumination path between the illumination light source and the measurement sample. The SLM is configured to modulate amplitude, phase, or both, across the path of the illumination light to reduce wavefront errors. In some embodiments, the desired state of the SLM is based on wavefront measurements performed in an optical path of the metrology system. In another aspect, an illumination aperture having an image plane tilted at an oblique angle with respect to a beam of illumination light is employed to overcome defocusing effects in metrology systems that employ oblique illumination of the measurement sample. In some embodiments, the illumination aperture, objective lens, and specimen are aligned to satisfy the Scheimpflug condition.

    Abstract translation: 呈现方法和系统以减少投影到测量目标上的照明光点尺寸和相关联的外溢到测量目标周围的区域。 在一个方面，空间光调制器（SLM）位于照明光源和测量样本之间的照明路径中。 SLM被配置为在照明光的路径上调制幅度，相位或两者以减少波前误差。 在一些实施例中，SLM的期望状态基于在计量系统的光路中执行的波前测量。 在另一方面，采用具有相对于照明光束倾斜倾斜角的图像平面的照明孔，以克服采用测量样品的倾斜照明的度量系统中的散焦效应。 在一些实施例中，照明孔径，物镜和样本被对准以满足Scheimpflug条件。

    METHODS AND SYSTEMS FOR MEASUREMENT OF THICK FILMS AND HIGH ASPECT RATIO STRUCTURES
    3.
    发明申请
    METHODS AND SYSTEMS FOR MEASUREMENT OF THICK FILMS AND HIGH ASPECT RATIO STRUCTURES 审中-公开

    公开(公告)号：WO2018152382A1

    公开(公告)日：2018-08-23

    申请号：PCT/US2018/018457

    申请日：2018-02-16

    Applicant: KLA-TENCOR CORPORATION

    Inventor： SAPIENS, Noam ,  KRISHNAN, Shankar ,  WANG, David Y. ,  BUETTNER, Alexander ,  PURRUCKER, Kerstin ,  PETERLINZ, Kevin A.

    IPC: H01L21/66 ,  H01L21/67

    Abstract: Methods and systems for performing spectroscopic measurements of semiconductor structures including ultraviolet, visible, and infrared wavelengths greater than two micrometers are presented herein. A spectroscopic measurement system includes a combined illumination source including a first illumination source that generates ultraviolet, visible, and near infrared wavelengths (wavelengths less than two micrometers) and a second illumination source that generates mid infrared and long infrared wavelengths (wavelengths of two micrometers and greater). Furthermore, the spectroscopic measurement system includes one or more measurement channels spanning the range of illumination wavelengths employed to perform measurements of semiconductor structures. In some embodiments, the one or more measurement channels simultaneously measure the sample throughout the wavelength range. In some other embodiments, the one or more measurement channels sequentially measure the sample throughout the wavelength range.

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