-
公开(公告)号：EP2939307B1
公开(公告)日：2018-10-03
申请号：EP13867509.5
申请日：2013-09-12
Inventor： BAE, Hyeon Min , SONG, Ha II , JIN, Huxian
Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
-
2.发明公开LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE 审中-公开低功耗和高速多通道芯片到芯片接口与介质波导
公开(公告)号：EP2939307A1
公开(公告)日：2015-11-04
申请号：EP13867509.5
申请日：2013-09-12
Inventor： BAE, Hyeon Min , SONG, Ha II , JIN, Huxian
IPC: H01P3/16
Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
-
Search Results
2
records
(took 0.035 seconds)
