WAFER INSPECTION APPARATUS AND METHOD OF INSPECTING WAFER USING SAME

    公开(公告)号:US20250020445A1

    公开(公告)日:2025-01-16

    申请号:US18771012

    申请日:2024-07-12

    Abstract: Proposed are a wafer inspection apparatus and a method of inspecting a wafer using the wafer inspection apparatus. The proposed wafer inspection apparatus includes a horizontal magnetic field generation unit arranged proximate to a lateral surface of a wafer and forming a magnetic field in such a manner that lines of magnetic force propagate in a horizontal direction, a vertical magnetic field generation unit arranged under the wafer and generating a magnetic field in such a manner that lines of magnetic force propagate in a direction vertical to the wafer, an image measurement unit arranged over the wafer and measuring an image of the wafer, and a wafer movement stage moving the wafer in a first direction and a second direction.

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