公开(公告)号：US20160365463A1

公开(公告)日：2016-12-15

申请号：US14826708

申请日：2015-08-14

Applicant: Korea Research Institute of Standards and Science

Inventor： Sang-Jun Lee ,  Sang-Woo Kang ,  Jun-Oh Kim

IPC: H01L31/0216 ,  H01L31/0304 ,  H01L31/0352 ,  H01L31/109 ,  H01L31/18

CPC classification number: H01L31/02161 ,  H01L31/02162 ,  H01L31/02327 ,  H01L31/035218 ,  H01L31/035236 ,  H01L31/09 ,  H01L31/184 ,  Y02E10/544

Abstract: Provided are an infrared photodetector and a method for manufacturing the same. The infrared photodetector includes a bottom contact layer, a light absorption layer stacked on the bottom contact layer, a top contact layer stacked on the light absorption layer, a metal layer stacked on the top contact layer to induce surface plasmon resonance and having a plurality of holes, and a dielectric layer stacked on the metal layer to satisfy an antireflection condition with respect to externally impinging light at a surface plasmon resonance frequency. The dielectric layer is a benzocyclobutene (BCB) layer.

Abstract translation: 提供一种红外光电检测器及其制造方法。 红外光电检测器包括底接触层，堆叠在底接触层上的光吸收层，堆叠在光吸收层上的顶接触层，层叠在顶接触层上以诱导表面等离子体共振并具有多个 以及层叠在金属层上的电介质层，以满足相对于表面等离子体共振频率的外部照射光的防反射条件。 电介质层是苯并环丁烯（BCB）层。

公开(公告)号：US10811551B2

公开(公告)日：2020-10-20

申请号：US16097590

申请日：2017-11-14

Applicant: Korea Research Institute of Standards and Science

Inventor： Sang-Jun Lee ,  Jun-Oh Kim ,  Yeongho Kim ,  Sang-Woo Kang

IPC: H01L31/046 ,  H01L31/0224 ,  H01L31/0687 ,  H01L31/0392 ,  H01L31/18 ,  H01L31/05 ,  H01L31/054

Abstract: A tandem solar cell includes a substrate a plurality of sub-cells stacked on the substrate and configured to sequentially perform photoelectric conversion with different wavelength band, and a metal disk array disposed on at least one of interfaces between adjacent sub-cells. A center wavelength of wavelength bands corresponding to the sub-cells gradually decreases as progressing downward with respect to an uppermost layer. The metal disk array reflects a light transmitting a sub-cell disposed over the metal disk array without being absorbed therein. The metal disk array is inserted by means of wafer bonding.