公开(公告)号：MY144454A

公开(公告)日：2011-09-30

申请号：MYPI20084533

申请日：2007-05-10

Applicant: LAM RES CORP

Inventor： ALGIRDAS VASKELIS ,  EUGENIJUS NORKUS ,  JANE JACIAUSKIENE ,  ALDONA JAGMINIENE

IPC: C23C18/38

Abstract: AN ELECTROLESS COPPER PLATING SOLUTION IS DISCLOSED HEREIN. THE SOLUTION INCLUDES AN AQUEOUS COPPER SALT COMPONENT, AN AQUEOUS COBALT SALT COMPONENT, A TRIAMINE BASED COMPLEXING AGENT, AND AN ACIDIC PH-MODIFYING SUBSTANCE IN AN AMOUNT SUFFICIENT TO MAKE THE ELECTROLESS COPPER PLATING SOLUTION ACIDIC. A METHOD OF PREPARING AN ELECTROLESS TO COPPER SOLUTION IS ALSO PROVIDED.

公开(公告)号：MY147845A

公开(公告)日：2013-01-31

申请号：MYPI20085290

申请日：2007-05-25

Applicant: LAM RES CORP

Inventor： YEZDI DORDI ,  WILLIAM THIE ,  ALGIRDAS VASKELIS ,  EUGENIJUS NORKUS ,  JANE JACIAUSKIENE ,  ALDONA JAGMINIENE

IPC: C23C18/38

Abstract: AN ELECTROLESS COPPER PLATING SOLUTION IS DISCLOSED HEREIN. THE SOLUTION INCLUDES AN AQUEOUS COPPER SALT COMPONENT, AN AQUEOUS COBALT SALT COMPONENT, A POLYAMINE-BASED COMPLEXING AGENT, A CHEMICAL BRIGHTENER COMPONENT, A HALIDE COMPONENT, AND A PH-MODIFYING SUBSTANCE IN AN AMOUNT SUFFICIENT TO MAKE THE ELECTROLESS COPPER PLATING SOLUTION ACIDIC. A METHOD (100) OF PREPARING AN ELECTROLESS COPPER SOLUTION IS ALSO PROVIDED.