公开(公告)号：US20150116575A1

公开(公告)日：2015-04-30

申请号：US14066236

申请日：2013-10-29

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： CHARLES IAN DADUYA FERRARIS

IPC: G02B13/00 ,  H04N5/225 ,  G02B5/23 ,  G02B3/00 ,  G02B7/04

CPC classification number: G02B13/0055 ,  G02B3/0037 ,  G02B7/08 ,  H04N5/2254

Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame for covering the image sensing chip and a movable lens assembly movably disposed in the housing frame. The movable lens assembly includes a movable casing movably disposed in the housing frame, at least one optical lens group disposed in the movable casing, a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.

Abstract translation: 图像捕获模块包括图像感测单元和光学辅助单元。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 光学辅助单元包括用于覆盖图像感测芯片的壳体框架和可移动地设置在壳体框架中的可移动透镜组件。 可移动透镜组件包括可移动地设置在壳体框架中的可移动壳体，设置在可动壳体中的至少一个光学透镜组，设置在可动壳体中的微透镜阵列基板和设置在微透镜阵列基板上的非导电感光膜层， 增加光吸收能力。

公开(公告)号：US20150116588A1

公开(公告)日：2015-04-30

申请号：US14063680

申请日：2013-10-25

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： CHARLES IAN DADUYA FERRARIS

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  G02B7/08 ,  G03B3/10 ,  G03B5/00 ,  H04N5/2257

Abstract: An image capturing module includes an image sensing unit and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate. The actuator structure includes a first actuator unit and a second actuator unit. The first actuator unit includes a first housing frame and a first movable assembly movably disposed inside the first housing frame and above the image sensing unit. The second actuator unit includes a second housing frame and a second movable assembly movably disposed inside the second housing frame and above the image sensing unit, and the second movable assembly includes a second movable casing movably disposed in the second housing frame, a microlens array substrate disposed in the second movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.

Abstract translation: 图像捕获模块包括图像感测单元和致动器结构。 图像感测单元包括载体基板和设置在载体基板上的图像感测芯片。 致动器结构包括第一致动器单元和第二致动器单元。 第一致动器单元包括第一壳体框架和可移动地设置在第一壳体框架内部和图像感测单元上方的第一可移动组件。 第二致动器单元包括第二壳体框架和可移动地设置在第二壳体框架内部和图像感测单元上方的第二可移动组件，并且第二可移动组件包括可移动地设置在第二壳体框架中的第二可移动壳体，微透镜阵列基板 设置在第二可移动壳体中，以及设置在微透镜阵列基板上的用于增加光吸收能力的非导电感光膜层。