公开(公告)号：US20150116589A1

公开(公告)日：2015-04-30

申请号：US14065390

申请日：2013-10-28

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： SHIN-DAR JAN

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H04N5/23245

Abstract: An image capturing module for reducing assembly tilt angle includes an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame disposed on the carrier substrate to cover the image sensing chip and a lens assembly disposed inside the housing frame and above the image sensing chip. The leveling auxiliary unit includes a plurality of adhesive materials disposed on the image sensing chip and a light-transmitting leveling substrate supported above the image sensing chip by the adhesive materials. The housing frame directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesive material is formed by mixing adhesive glue and a plurality of micro support bodies.

Abstract translation: 一种用于减小组装倾斜角度的图像捕获模块包括图像感测单元，光学辅助单元和调平辅助单元。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 光学辅助单元包括设置在载体基板上以覆盖图像感测芯片的壳体框架和设置在壳体框架内部和图像感测芯片上方的透镜组件。 调平辅助单元包括设置在图像感测芯片上的多个粘合材料和通过粘合材料支撑在图像感测芯片上方的透光调平基板。 壳体框架直接接触并向下抵靠光透射调平基板，并且每个粘合材料通过混合胶粘剂和多个微支撑体而形成。

公开(公告)号：US20150116954A1

公开(公告)日：2015-04-30

申请号：US14066163

申请日：2013-10-29

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： SHIN-DAR JAN

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10575 ,  Y02P70/611

Abstract: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip.

Abstract translation: 提供图像传感器模块。 图像传感器模块包括电路板，扁平材料，图像感测芯片，保持器和覆盖板。 设置在电路板的组装表面上的扁平材料具有支撑表面和与其相对的底表面。 其基面朝向支撑表面的图像感测芯片被配置在支撑表面上。 保持器设置在平坦材料上，并且保持器的底面面向支撑表面。 支撑面用于使底面平行于底面。 覆盖板布置在保持器上以密封图像感测芯片。

公开(公告)号：US20150116580A1

公开(公告)日：2015-04-30

申请号：US14065380

申请日：2013-10-28

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： SHIN-DAR JAN

IPC: G02B7/00 ,  H04N5/225

CPC classification number: G02B7/003 ,  H04N5/2254 ,  Y10T29/49002

Abstract: An image capturing module includes an image sensing unit and an actuator unit. The image sensing unit includes a circuit substrate and an image sensing chip disposed on the circuit substrate. The actuator unit includes a housing frame disposed on the circuit substrate and a movable lens assembly movably disposed inside the housing frame. The image sensing chip includes an image sensing area having a first geometric center line and a first geometric center point, and the movable lens assembly has a second geometric center line and a second geometric center point. Whereby, when the predetermined energy is provided for the actuator unit to shift the movable lens assembly, the second geometric center line (or the second geometric center point) of the movable lens assembly can be accurately aligned with the first geometric center line (or the first geometric center point) of the image sensing area.

Abstract translation: 图像捕获模块包括图像感测单元和致动器单元。 图像感测单元包括电路基板和设置在电路基板上的图像感测芯片。 致动器单元包括设置在电路基板上的壳体框架和可移动地设置在壳体框架内部的可移动透镜组件。 图像感测芯片包括具有第一几何中心线和第一几何中心点的图像感测区域，并且可移动透镜组件具有第二几何中心线和第二几何中心点。 由此，当为致动器单元提供预定能量以移动可移动透镜组件时，可移动透镜组件的第二几何中心线（或第二几何中心点）可以准确地与第一几何中心线（或 第一几何中心点）的图像感测区域。