公开(公告)号：US20240421133A1

公开(公告)日：2024-12-19

申请号：US18292714

申请日：2022-06-07

Applicant: LG ELECTRONICS INC.

Inventor： Daewoon HONG ,  Taehyun KIM ,  Dahye KIM ,  Jaesang MIN ,  Sangtae PARK

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: The present invention relates to a light emitting element package manufacturing method and a display apparatus manufacturing method. According to an embodiment of the present invention, a light emitting element package manufacturing method may be provided, the method comprising the steps of: providing a substrate having, on one surface, a plurality of first pads and a plurality of second pads; arranging a plurality of light emitting elements on the substrate so that the light emitting elements are electrically connected to the plurality of second pads, respectively; arranging a plurality of joint parts on the one surface of the substrate so that the joint parts are electrically connected to the plurality of first pads, respectively; and sawing the substrate so as to form a light source that has at least one of the plurality of light emitting elements.

公开(公告)号：US20240297284A1

公开(公告)日：2024-09-05

申请号：US18270801

申请日：2021-12-06

Applicant: LG ELECTRONICS INC.

Inventor： Daewoon HONG ,  Taehyun KIM ,  Dahye KIM ,  Sangtae PARK

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/486 ,  H01L33/54

Abstract: A light-emitting device package may comprise: a drive part which has a first pad and a second pad disposed at one surface thereof, the second pad being electrically connected to a light-emitting device, and controls driving of the light-emitting device; the light-emitting device disposed on the second pad; and a bonding part, wherein the light-emitting device and the bonding part may be disposed together on one surface of the drive part.