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公开(公告)号:US20240421133A1
公开(公告)日:2024-12-19
申请号:US18292714
申请日:2022-06-07
Applicant: LG ELECTRONICS INC.
Inventor: Daewoon HONG , Taehyun KIM , Dahye KIM , Jaesang MIN , Sangtae PARK
IPC: H01L25/075 , H01L33/54 , H01L33/62
Abstract: The present invention relates to a light emitting element package manufacturing method and a display apparatus manufacturing method. According to an embodiment of the present invention, a light emitting element package manufacturing method may be provided, the method comprising the steps of: providing a substrate having, on one surface, a plurality of first pads and a plurality of second pads; arranging a plurality of light emitting elements on the substrate so that the light emitting elements are electrically connected to the plurality of second pads, respectively; arranging a plurality of joint parts on the one surface of the substrate so that the joint parts are electrically connected to the plurality of first pads, respectively; and sawing the substrate so as to form a light source that has at least one of the plurality of light emitting elements.
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公开(公告)号:US20240297284A1
公开(公告)日:2024-09-05
申请号:US18270801
申请日:2021-12-06
Applicant: LG ELECTRONICS INC.
Inventor: Daewoon HONG , Taehyun KIM , Dahye KIM , Sangtae PARK
IPC: H01L33/62 , H01L25/075 , H01L27/12 , H01L33/48 , H01L33/54
CPC classification number: H01L33/62 , H01L25/0753 , H01L27/124 , H01L33/486 , H01L33/54
Abstract: A light-emitting device package may comprise: a drive part which has a first pad and a second pad disposed at one surface thereof, the second pad being electrically connected to a light-emitting device, and controls driving of the light-emitting device; the light-emitting device disposed on the second pad; and a bonding part, wherein the light-emitting device and the bonding part may be disposed together on one surface of the drive part.
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