公开(公告)号：US10825702B2

公开(公告)日：2020-11-03

申请号：US16388394

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu Shim ,  Dohee Kim ,  Changseo Park ,  Hyunwoo Cho

IPC: H01L21/67 ,  H01L21/44 ,  H01L25/075 ,  H01L33/62 ,  B65G47/92 ,  B65G47/14 ,  B65G47/49 ,  H01L29/82 ,  H01L33/00

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：US12230617B2

公开(公告)日：2025-02-18

申请号：US17616125

申请日：2019-06-11

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu Shim ,  Dohee Kim ,  Yongil Shin ,  Dohwan Yang

IPC: H01L25/16 ,  H01L23/00 ,  H01L27/12 ,  H01L33/00 ,  H01L33/20 ,  H01L33/32

Abstract: A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.

公开(公告)号：US11502055B2

公开(公告)日：2022-11-15

申请号：US16689810

申请日：2019-11-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo Cho ,  Bongchu Shim ,  Dohee Kim

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

公开(公告)号：US12293995B2

公开(公告)日：2025-05-06

申请号：US17638163

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohwan Yang ,  Dohee Kim ,  Yongil Shin ,  Bongchu Shim

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: A device for collecting semiconductor light emitting diodes according to an embodiment of the present disclosure includes an electromagnet portion disposed in a fluid chamber into which semiconductor light emitting diodes including a magnetic material are put to form a magnetic field when power is applied, a power supply portion connected to the electromagnet portion and applying power to the electromagnet portion, and a driving portion moving the electromagnet portion in a width direction, in a longitudinal direction, and in a height direction of the fluid chamber, in which the electromagnet portion guides the semiconductor light emitting devices to a surface on which a magnetic field is formed when power is applied.

公开(公告)号：US12080689B2

公开(公告)日：2024-09-03

申请号：US17632058

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohee Kim ,  Gunho Kim ,  Yongil Shin ,  Bongchu Shim ,  Hyunwoo Cho

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/83 ,  H01L24/95 ,  H01L24/29 ,  H01L24/32 ,  H01L33/007 ,  H01L33/0093 ,  H01L2224/29021 ,  H01L2224/32237 ,  H01L2224/83801 ,  H01L2224/95101 ,  H01L2224/95133 ,  H01L2224/95136

Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

公开(公告)号：US11437352B2

公开(公告)日：2022-09-06

申请号：US17254656

申请日：2018-07-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon Kim ,  Dohee Kim

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

Abstract: Discussed are a display device, and a method of manufacturing the display device. The display device includes a substrate having a plurality of metal pads, and a semiconductor light-emitting element electrically connected to the plurality of metal pads through self-assembly. Specifically, each metal pad includes a bonding metal electrically connected to a conductive electrode of a respective semiconductor light-emitting element, and a coating layer encompassing the bonding metal.