公开(公告)号：US12068771B2

公开(公告)日：2024-08-20

申请号：US17785345

申请日：2020-02-28

Applicant: LG ELECTRONICS INC.

Inventor： Jongwook Jeon ,  Jaeho Lee

IPC: B60R16/023 ,  H04B1/3822 ,  H05K5/00 ,  H04W4/46

CPC classification number: H04B1/3822 ,  B60R16/0239 ,  H05K5/0065 ,  H04W4/46

Abstract: A modular control device for a vehicle comprises: a base frame mounted on the vehicle; and an upgrade frame detachably mounted on the base frame. A first printed circuit board (PCB), on which a base block for providing an interface with devices in the vehicle is implemented, is mounted on the base frame. A second PCB having a memory and a main processor is mounted on the upgrade frame.