Abstract:
Antennas capable of supporting high frequencies are disclosed, for example, a transparent antenna applicable to glass for vehicles is disclosed. A transparent antenna installed on a glass includes an adhesive layer attached to the glass, a transparent substrate disposed on the adhesive layer, an antenna structure layer disposed on the transparent substrate, a protective layer disposed on the antenna structure layer, and a power feeding portion connected to the antenna structure layer.
Abstract:
An antenna apparatus and an image display apparatus including the same are disclosed. An antenna apparatus according to an embodiment of the present disclosure comprises a substrate, a metal mesh disposed on a portion of an upper portion of the substrate, and a protective layer disposed on the metal mesh, wherein the protective layer and the substrate are more transparent than the metal mesh. Accordingly, breakage of a metal mesh inside a transparent antenna apparatus may be reduced.
Abstract:
The present invention relates to a hairpin-type probe for detecting a target substance and a method for detecting a target substance using the probe. The hairpin-type probe comprises a loop comprising a target substance recognition site, and a stem comprising an aptamer having an electrochemical signaling material bound thereto. The hairpin structure is broken when it is hybridized to the target substance, and thus the signaling material is separated from the aptamer and can freely move to the electrode. Based on the change in the electrochemical signal generated from the signaling material, the amount of the target substance can be accurately detected in real-time.
Abstract:
The present embodiment provides a composite film in which a plurality of composite inorganic particles, which are inorganic particles having a fluoropolymer coating film formed therein, are sintered to form a plane shape. Therefore, the low dielectric inorganic particle composite film may reduce signal loss by being hybridized with an interlayer insulator in a high-frequency 5G area. The low dielectric inorganic particles may minimize transmission loss by enhancing dielectric properties when applied to a 5G smartphone substrate and an IF cable, since the composite film used as an interlayer insulator for a communication substrate material comprises only the inorganic particles. In addition, application of the low dielectric inorganic particles may be expanded to vehicles, construction, and IoT products which will use 5G communication in the future.
Abstract:
An antenna assembly for a vehicle can include a first glass including a black mask region; a second glass disposed opposite to the first glass; a film layer disposed between the first glass and the second glass; a transparent substrate disposed in an inner region of the film layer, the transparent substrate including an antenna transparent electrode portion; and a substrate and a feed line disposed on the substrate, the feed line being electrically connected to the antenna transparent electrode portion of the transparent substrate, in which at least a portion of the antenna transparent electrode portion overlaps with the black mask region, at least a portion of the feed line is disposed to overlap the black mask region.
Abstract:
The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The composite polyimide substrate according to the present invention may include: a substrate main body including a polyimide of which at least a portion has been substituted with a polyester group; and polytetrafluoroethylene (PTFE) particles included in the substrate main body.
Abstract:
The present disclosure relates to polyimide and a preparation method thereof. The polyimide according to an embodiment of the present disclosure comprises: silica having pores; and a fluorinated alkyl chain attached to the surface of the silica having pores, and is prepared by mixing a dispersion solution comprising the silica having pores and an organic solution comprising a polyimide precursor. Accordingly, hygroscopicity is reduced, and dispersibility can be enhanced.
Abstract:
The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.