公开(公告)号：US20230110862A1

公开(公告)日：2023-04-13

申请号：US17904506

申请日：2020-02-25

Applicant: LG ELECTRONICS INC.

Inventor： Youngdo KIM ,  Soohyun KIM ,  Indo CHUNG ,  Jeonghyo KWON ,  Junoh SHIN

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/62

Abstract: A display apparatus according to the present invention comprises a substrate including semiconductor light-emitting devices and a wiring electrode electrically connected to the semiconductor light-emitting devices, wherein the substrate comprises: a base portion; assembly electrodes extending in one direction and arranged on the base portion; a dielectric layer formed to cover the assembly electrodes; a barrier portion formed on the dielectric layer while forming a cell on which the semiconductor light-emitting devices are mounted along an extension direction of the assembly electrodes; and a planarization layer formed to cover the barrier portion while forming a hole overlapping the cell, wherein the hole comprises: a first hole exposing the semiconductor light-emitting device; and a second hole exposing the dielectric layer or the base portion.

公开(公告)号：US20240421264A1

公开(公告)日：2024-12-19

申请号：US18706161

申请日：2021-11-01

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Hongcheol LEE ,  Doohwan YANG ,  Youngdo KIM

IPC: H01L33/48 ,  H01L25/16 ,  H01L33/62

Abstract: A display device includes a substrate, a first assembly wiring and second assembly wiring on the substrate, a first insulating layer on the first and second assembly wirings, a barrier wall comprising a hole on the first insulating layer, a semiconductor light emitting device in the hole, and a connection part is configured to electrically connect a side of the semiconductor light emitting device and at least one assembly wiring of the first and second assembly wirings. A gap between an inner surface of the hole and an outer surface of the semiconductor light emitting device is 50% to 200% of a thickness of the semiconductor light emitting device.

公开(公告)号：US20170104114A1

公开(公告)日：2017-04-13

申请号：US15288220

申请日：2016-10-07

Applicant: LG ELECTRONICS INC.

Inventor： Bojoong KIM ,  Minypo KIM ,  Daeseon HYUN ,  Hyunjung PARK ,  Ahreum LEE ,  Youshin HAN ,  Youngdo KIM

IPC: H01L31/0224 ,  H01L31/05

CPC classification number: H01L31/022441 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/0745 ,  Y02E10/547

Abstract: A solar cell module includes a plurality of solar cells each including a semiconductor substrate and first electrodes and second electrodes extended on a back surface of the semiconductor substrate, first conductive lines connected to the first electrodes at crossings between the first electrodes and the first conductive lines through first conductive adhesive layers, second conductive lines connected to the second electrodes at crossings between the second electrodes and the second conductive lines through the first conductive adhesive layers, and an intercell connector extended between a first solar cell and a second solar cell that are adjacent to each other. The first conductive lines connected to the first solar cell and the second conductive lines connected to the second solar cell are commonly connected to the intercell connector.

公开(公告)号：US20250048816A1

公开(公告)日：2025-02-06

申请号：US18717888

申请日：2022-11-28

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Youngdo KIM ,  Hun JANG ,  Juhyun NAM ,  Hyeseon EOM ,  Minseok KIM

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: A display device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring spaced apart from each other on the substrate, a first insulating layer disposed between the first assembly wiring and the second assembly wiring, a first planarization layer disposed on the second assembly wiring and having an opening overlapping the second assembly wiring, a light emitting device disposed inside the opening and including a first semiconductor layer and a second semiconductor layer on the first semiconductor layer, and contact electrode electrically connecting the second assembly wiring and the first semiconductor layer, and the contact electrode is in contact with the second assembly wiring that overlaps the side surface of the first semiconductor layer and the first planarization layer.

公开(公告)号：US20250023002A1

公开(公告)日：2025-01-16

申请号：US18713565

申请日：2022-10-11

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Youngdo KIM ,  Juhyun NAM ,  Hun JANG ,  Sul LEE ,  Minseok KIM ,  Hyeseon EOM ,  Moonsun LEE

IPC: H01L33/62 ,  H01L33/38

Abstract: A display device including a semiconductor light emitting device according to an embodiment may include a substrate, a first assembly wiring and a second assembly wiring arranged to be spaced apart from each other on the substrate, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having an opening overlapping the first assembly wiring and the second assembly wiring, a light emitting device including a first electrode placed inside the opening and electrically connected to the first assembly wiring, and wherein the opening includes a main opening and one or more auxiliary openings that are connected to the main opening and are smaller than the main opening.

公开(公告)号：US20230045160A1

公开(公告)日：2023-02-09

申请号：US17778691

申请日：2019-11-26

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Dohan KIM ,  Wonseok CHOI ,  Youngdo KIM

IPC: H01L33/00 ,  H01L25/075 ,  G01R27/02 ,  G01R1/073

Abstract: Discussed is a method of manufacturing a display device, the method including: introducing semiconductor light emitting devices including a magnetic material into a fluid chamber; transferring a substrate to the fluid chamber, the substrate including assembly electrodes, an insulating layer covering the assembly electrodes, and open holes in the insulating layer and exposing portions of both ends of the assembly electrodes; applying a magnetic force to the semiconductor light emitting devices introduced into the fluid chamber to move the semiconductor light emitting devices in one direction; and forming an electric field so that the moving semiconductor light emitting devices are disposed at preset positions of the substrate, wherein a probe pin is in contact with the assembly electrodes exposed through the open holes to individually apply a voltage to the assembly electrodes to form the electric field.

公开(公告)号：US20240258480A1

公开(公告)日：2024-08-01

申请号：US18290644

申请日：2022-07-22

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Youngdo KIM ,  Hyeseon EOM ,  Juhyun NAM ,  Hun JANG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/54

Abstract: A display device according to the embodiment includes a substrate, a first assembly wiring and a second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having an opening and a contact portion, a light emitting device disposed inside the opening and having a first electrode overlapping the first assembly wiring and the second assembly wiring, and a pixel electrode disposed on the planarization layer and in contact with the second electrode of the light emitting device through a contact portion, and the plurality of contact units may overlap a portion of at least one side of the area where the light emitting device is disposed.

公开(公告)号：US20230420423A1

公开(公告)日：2023-12-28

申请号：US18247789

申请日：2020-10-06

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Junoh SHIN ,  Youngdo KIM ,  Wonseok CHOI ,  Dohan KIM

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L2933/0066 ,  H01L33/62

Abstract: A display device according to embodiments of the present invention comprises: a substrate; a plurality of first metal wiring layers formed on the substrate; a first insulating layer stacked on the substrate to cover the first metal wiring; a second metal wiring layer stacked on at least a portion of the first insulating layer so as to be spaced apart therefrom; and a second insulating layer stacked on the second metal wiring. The second metal wiring layer comprises: at least one first metal layer having a first conductivity; and at least one second metal layer having a higher conductivity than the first metal layer, wherein the first metal layer may block diffusion of the second metal layer.

公开(公告)号：US20190288135A1

公开(公告)日：2019-09-19

申请号：US16433960

申请日：2019-06-06

Applicant: LG ELECTRONICS INC.

Inventor： Bojoong KIM ,  Minpyo KIM ,  Daeseon HYUN ,  Hyunjung PARK ,  Ahreum LEE ,  Youshin HAN ,  Youngdo KIM

IPC: H01L31/0224 ,  H01L31/068 ,  H01L31/0745 ,  H01L31/05

Abstract: A solar cell module includes a plurality of first conductive lines connected to a first electrode of a first solar cell and extended in a first direction; a plurality of second conductive lines connected to a second electrode of a second solar cell adjacent with the first solar cell and extended in the first direction; and an intercell connector spaced apart from the first solar cell and the second solar cell and extended in a second direction crossing the first direction, the intercell connector including a first connection portion connected with the plurality of first conductive lines and a second connection portion connected with the plurality of second conductive lines, wherein a separation distance between the first solar cell and the first connection portion is closer than a separation distance between the second solar cell and a part of the intercell connector positioned on the same line as the first connection portion.

公开(公告)号：US20250072188A1

公开(公告)日：2025-02-27

申请号：US18727604

申请日：2022-01-19

Applicant: LG ELECTRONICS INC.

Inventor： Jinhyeok CHOI ,  Indo CHUNG ,  Youngdo KIM

IPC: H01L33/62 ,  H01L25/075

Abstract: A display device can include a substrate, a first assembling wiring on the substrate, a second assembling wiring on the substrate, a partition wall disposed on the first and second assembling wirings and having a hole, a semiconductor light-emitting device disposed in the hole and having a first step difference part on a side portion thereof, and a connection electrode disposed on at least the first step difference part.