公开(公告)号：WO2017188700A1

公开(公告)日：2017-11-02

申请号：PCT/KR2017/004374

申请日：2017-04-25

Applicant: LG ELECTRONICS INC.

Inventor： HWANG, Insung ,  KIM, Moosub ,  JANG, Yunguk ,  JIN, Wonhyeog

IPC: G01N27/407 ,  G01N27/411

Abstract: A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.

Abstract translation: 披露了一种传感器。 该传感器包括第一基底; 相对于所述第一衬底定位的第二衬底; 位于所述第一基板和所述第二基板之间的第一电极，所述第一电极形成在所述第二基板上; 感测部分，其覆盖所述第一电极的至少一部分并进一步覆盖所述第二基板的至少一部分; 位于所述第一基板和所述第二基板之间的焊盘电极，其中所述焊盘电极形成在所述第二基板上并电耦合到所述第一电极; 以及位于第一基板和第二基板之间的键合焊盘，其中键合焊盘形成在第一基板上并电耦合到焊盘电极。

公开(公告)号：EP3449246A1

公开(公告)日：2019-03-06

申请号：EP17789884.8

申请日：2017-04-25

Applicant: LG Electronics Inc.

Inventor： HWANG, Insung ,  KIM, Moosub ,  JANG, Yunguk ,  JIN, Wonhyeog

IPC: G01N27/407 ,  G01N27/411