公开(公告)号：EP2602973B1

公开(公告)日：2014-07-16

申请号：EP12008045.2

申请日：2012-11-30

Applicant: LG Electronics Inc.

Inventor： Kim, Kyoungtae ,  Kwon, Soonsung ,  Park, Minho ,  Jo, Doohwan ,  Jeon, Sangchul

IPC: H04M1/02 ,  H01R12/70 ,  H01R12/72 ,  H01R13/73 ,  H01R13/453

CPC classification number: H01R13/73 ,  H01R12/7058 ,  H01R12/721 ,  H01R13/4538 ,  H01R2201/16 ,  H04M1/026 ,  H04M1/0274

公开(公告)号：EP2602973A1

公开(公告)日：2013-06-12

申请号：EP12008045.2

申请日：2012-11-30

Applicant: LG Electronics, Inc.

Inventor： Kim, Kyoungtae ,  Kwon, Soonsung ,  Park, Minho ,  Jo, Doohwan ,  Jeon, Sangchul

IPC: H04M1/02

CPC classification number: H01R13/73 ,  H01R12/7058 ,  H01R12/721 ,  H01R13/4538 ,  H01R2201/16 ,  H04M1/026 ,  H04M1/0274

Abstract: A mobile terminal in accordance with one exemplary embodiment of the present disclosure includes a terminal body, a substrate (240) mounted onto the terminal body, and a socket module (300) coupled to the substrate (240) to transfer an electrical signal by being electrically connected to an inserted plug, and the socket module (300) includes a housing (310) having an opening at one surface thereof, the plug being inserted into the opening, and a coupling unit (320) formed at at least one side of the housing (310), and slidable with respect to the substrate (240) upon being coupled to the substrate (240). This may allow a substrate assembly coupled with the socket module to become slimmer by a thickness of the substrate, resulting in providing a more size-reduced terminal.

Abstract translation: 根据本公开的一个示例性实施例的移动终端包括终端主体，安装到终端主体上的基板（240）和耦合到基板（240）的插座模块（300），以通过以下方式传送电信号： 电连接到插入的插头，并且插座模块（300）包括在其一个表面具有开口的壳体（310），插头插入开口中;以及耦合单元（320），其形成在 壳体（310），并且在耦合到衬底（240）时可相对于衬底（240）滑动。 这可以允许与插座模块耦合的衬底组件变得比基板的厚度更薄，从而提供更大尺寸减小的端子。