PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD FOR CONTROLLING THE SAME
    6.
    发明公开
    PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD FOR CONTROLLING THE SAME 审中-公开
    等离子体增强化学气相沉积设备及其控制方法

    公开(公告)号:EP2689050A2

    公开(公告)日:2014-01-29

    申请号:EP12765504.1

    申请日:2012-03-16

    CPC classification number: C23C16/54 C23C16/458 C23C16/50 C23C16/505 C23C16/509

    Abstract: There is disclosed a plasma enhanced chemical vapor deposition apparatus including a loading station to load an object on a pallet, an operation station to form a functional film by performing plasma reaction to the object loaded on the pallet, a unloading station to separate the object from the pallet, a circulation station to convey the pallet from the unloading station to the loading station, and a conveyer to convey the pallet to the stations sequentially to circulate the pallet.

    Abstract translation: 本发明公开了一种等离子体增强化学气相沉积设备,其包括用于将物体装载到托盘上的装载站,通过对装载在托盘上的物体执行等离子体反应来形成功能膜的操作站,用于将物体与托盘分离的卸载站 托盘,将托盘从卸载站传送到装载站的循环站,以及将托盘依次传送到站以使托盘循环的传送器。

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