公开(公告)号：EP4092735A1

公开(公告)日：2022-11-23

申请号：EP22170795.3

申请日：2022-04-29

Applicant: LG Electronics Inc.

Inventor： OH, Taesu ,  MOON, Joonkwon ,  PARK, Sungjin ,  CHOI, Bongseok

IPC: H01L25/075 ,  H01L33/00

Abstract: A display device includes a substrate including a plurality of pixels, a plurality of protrusions on the substrate, an adhesive layer on the substrate, and a plurality of semiconductor light emitting devices on the adhesive layer. The semiconductor light emitting devices can be disposed in a pixel among the plurality of pixels, and the plurality of protrusions can be disposed around the plurality of semiconductor light emitting devices in the pixel.

公开(公告)号：EP4167280A1

公开(公告)日：2023-04-19

申请号：EP20939511.0

申请日：2020-06-12

Applicant: LG Electronics, Inc.

Inventor： OH, Taesu ,  MOON, Joonkwon ,  PARK, Sungjin ,  CHOI, Bongseok

IPC: H01L25/075

Abstract: An embodiment relates to a display device comprising a semiconductor light-emitting device. A display device comprising a semiconductor light-emitting device, according to an embodiment, can comprise: a main pixel group including a plurality of main pixels; and a shared redundancy pixel including a plurality of shared light-emitting devices arranged between and on the periphery of the plurality of main pixels. The main pixel group can comprise the plurality of main pixels, each of which includes a first semiconductor light-emitting device, a second semiconductor light-emitting device, and a third semiconductor light-emitting device. The shared redundancy pixel can comprise: first group shared light-emitting devices arranged between the plurality of main pixels; and second shared light-emitting devices arranged on the periphery of the plurality of main pixels.

公开(公告)号：EP4478410A1

公开(公告)日：2024-12-18

申请号：EP22927490.7

申请日：2022-02-21

Applicant: LG Electronics Inc.

Inventor： CHOI, Bongseok ,  MOON, Joonkwon ,  PARK, Sungjin ,  KIM, Soohyun ,  OH, Taesu

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62 ,  H01L33/40 ,  H01L27/12

Abstract: A light-emitting element package can include a first layer having an oval shape, a first semiconductor light-emitting element group on the first layer, a first electrode pad group on the first layer, and a second electrode pad group on the first layer.
The first layer can have a first region comprising an oval major axis, a second region contacting the first region on one side of the oval major axis, and a third region contacting the first region on the other side of the oval major axis. The first semiconductor light-emitting element group can be disposed on the first region and can include a plurality of semiconductor light-emitting elements. The first electrode pad group can be disposed on the second region and can include a plurality of electrode pads. The second electrode pad group can be disposed on the third region and can include a plurality of redundancy electrode pads.