公开(公告)号：WO2015059499A3

公开(公告)日：2015-06-18

申请号：PCT/GB2014053187

申请日：2014-10-24

Applicant: LITECOOL LTD

Inventor： REEVES JAMES ,  YOUNG ANDREW

IPC: H05K1/02 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K1/021 ,  H01L33/48 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: According to a first aspect of the present invention there is provided a LED module. The LED module comprises a circuit board provided with an aperture that extends through the circuit board, and an LED package comprising one or more LED die mounted to a conductive substrate, the LED package being mounted to the circuit board with the one or more LED die aligned with the aperture. A first electrical connection between each of the one or more LED die and the circuit board is provided by a junction of a surface of the conductive substrate and a first electrical track provided on the circuit board, and a second electrical connection between each of the one or more LED die and the circuit board is provided by an interconnect device connecting the LED die to a second electrical track provided on the circuit board.

Abstract translation: 根据本发明的第一方面，提供了一种LED模块。 所述LED模块包括设置有延伸穿过所述电路板的孔的电路板以及包括安装至导电衬底的一个或多个LED管芯的LED封装，所述LED封装通过所述一个或多个LED管芯安装至所述电路板 与光圈对齐。 所述一个或多个LED管芯中的每一个与所述电路板之间的第一电连接通过所述导电基板的表面与设置在所述电路板上的第一电气轨道的接合部来提供，并且所述第一电连接部 或更多的LED管芯，并且电路板由将LED管芯连接到设置在电路板上的第二电气迹线的互连装置提供。