公开(公告)号：JP2000089185A

公开(公告)日：2000-03-31

申请号：JP21311699

申请日：1999-07-28

Applicant: LITTON SYSTEMS INC

Inventor： SHAFER KENNETH W ,  ABBINK HENRY C ,  RAHN JOHN P ,  GEOSLING CHRISTINE E ,  ZIMMERMAN GREGORY A

IPC: H01L33/00 ,  G02B6/12 ,  G02B6/30 ,  G02F1/035 ,  H01L31/0232

Abstract: PROBLEM TO BE SOLVED: To provide an integrated optical element which is accompanied by performance improved when the element is exposed to a temp. change. SOLUTION: The optical element or the integrated optical element or an MIOC has a top face 12, a +Z face 14 and a -Z face 16. The element is formed of a crystal, such as lithium or niobic acid, having a high electron-optic coefft. The +Z crystal axis elongates outward from the +Z face and the Z-axis is the axis which crosses the same and at which the pyroelectric effect is exhibited for the purpose of directing the parts of the optical elements to be disclosed. The top face is orthogonal with the Z-axis. An input waveguide 18 on the top surface receives a light signal from an input port 20 and passes the signal via a waveguide network to an output waveguide 26 connected to an output port. Part of the +Z and -Z face are at least partly coated with a conductive coating material. The conduction path couples the +Z and -Z face faces to prevent the development of a charge difference between the +Z face and -Z faces in consequence of the temp. change and pyroelectric effect of the optical element.

公开(公告)号：JP2000047160A

公开(公告)日：2000-02-18

申请号：JP21311799

申请日：1999-07-28

Applicant: LITTON SYSTEMS INC

Inventor： GAMPP LORRIE L ,  ZIMMERMAN GREGORY A ,  GEOSLING CHRISTINE E ,  RAHN JOHN P

IPC: G02B6/12 ,  G02F1/035 ,  G02F1/313

Abstract: PROBLEM TO BE SOLVED: To prevent an electric charge difference from being generated between a 1st and a 2nd rail by providing a conduction bridge which is connected to the 1st and 2nd rails to form a conduction network. SOLUTION: The 1st and 2nd rails 38 and 40 which are arranged on the top surface of an optical element are formed of metal on the top surface across part of an input waveguide 18. The conduction bridge consists of a 1st rail conduction segment 54, a 1st joint pad 55, a 2nd rail conduction segment 56, and a 2nd joint pad 57. The 1st and 2nd joint pads 55 and 57 are connected by a conduction jumper bridge 58. Then the circuit consisting of the 1st rail conduction segment 54, 2nd rail conduction segment 56, 1st and 2nd joint pads 54 and 55, and conduction jumper bridge 58 forms the conduction network which operates to prevent an electric charge difference from being generated between the 1st and 2nd rails 30 and 40.

公开(公告)号：DE69939444D1

公开(公告)日：2008-10-16

申请号：DE69939444

申请日：1999-07-28

Applicant: LITTON SYSTEMS INC

Inventor： SHAFER KENNETH W ,  ABBINK HENRY C ,  RAHN JOHN P ,  GEOSLING CHRISTINE E ,  ZIMMERMAN GREGORY A

IPC: G02F1/035 ,  H01L33/00 ,  G02B6/12 ,  G02B6/30 ,  H01L31/0232

Abstract: An Integrated Optics Chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating. A conductive path couples the +Z and -Z faces to prevent a charge differential from developing between the +Z and -Z faces due to a change in temperature of the optic chip and the pyroelectric effect.

公开(公告)号：CA2279066C

公开(公告)日：2008-03-25

申请号：CA2279066

申请日：1999-07-28

Applicant: LITTON SYSTEMS INC

Inventor： ZIMMERMAN GREGORY A ,  ABBINK HENRY C ,  SHAFER KENNETH W ,  RAHN JOHN P ,  GEOSLING CHRISTINE E

IPC: G02B6/12 ,  H01L33/00 ,  G02B6/30 ,  G02F1/035 ,  H01L31/0232

Abstract: An Integrated Optics Chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating. A conductive path couples the +Z and -Z faces to prevent a charge differential from developing between the +Z and -Z faces due to a change in temperature of the optic chip and the pyroelectric effect.

公开(公告)号：CA2279068A1

公开(公告)日：2000-01-28

申请号：CA2279068

申请日：1999-07-28

Applicant: LITTON SYSTEMS INC

Inventor： ZIMMERMAN GREGORY A ,  GEOSLING CHRISTINE E ,  GAMPP LORRIE L ,  RAHN JOHN P

IPC: G02B6/12 ,  G02F1/035 ,  G02F1/313

Abstract: An Integrated Optics Chip with improved performance when exposed to rapidly changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face. An input waveguide formed in the top surface of the chip and orthogonal to the +Z axis receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. Metalization is applied to the top face of the optic chip to form at least a first and a second rail. The first and second rails are positioned to very closely straddle a portion of the input waveguide. A conductive bridge connects the first and second rails to prevent a charge differential from developing between the first and second rails.

公开(公告)号：CA2279066A1

公开(公告)日：2000-01-28

申请号：CA2279066

申请日：1999-07-28

Applicant: LITTON SYSTEMS INC

Inventor： ABBINK HENRY C ,  SHAFER KENNETH W ,  GEOSLING CHRISTINE E ,  RAHN JOHN P ,  ZIMMERMAN GREGORY A

IPC: H01L33/00 ,  G02B6/12 ,  G02B6/30 ,  G02F1/035 ,  H01L31/0232

Abstract: An Integrated Optics Chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating. A conductive path couples the +Z and -Z faces to prevent a charge differential from developing between the +Z and -Z faces due to a change in temperature of the optic chip and the pyroelectric effect.