RADIATION CURABLE TEMPORARY SOLDER MASK.
    1.
    发明公开
    RADIATION CURABLE TEMPORARY SOLDER MASK. 失效
    ABZIEHBARE,STRAHLUNGAUSHÄRTBARELÖTMASKE。

    公开(公告)号:EP0313580A4

    公开(公告)日:1989-05-16

    申请号:EP87905034

    申请日:1987-07-01

    Applicant: LOCTITE CORP

    Abstract: A temporary mask composition comprising: (1) a radiation curable monomer including a predominant amount of acrylic and capped prepolymer, (ACRYL)m-X, (2) a radical photoinitiator, (3) an adhesion reducing component selected from the group consisting of: (i) acrylic esters of fatty alcohols (I); (ii) vinyl esters of fatty acids (II) and (iii) monoacrylic esters of polyalkylene oxides (III) where ACRYL= (IV), x = a polymer residue or backbone, m > 2, n > 9, o > 8, p > 3, R = H or alkyl. A method for providing temporary masking of electronic components compatible with a high speed production operation is also disclosed. Suitably the adhesion of the cured composition (22) to the substrate (16) as measured in the tensile shear mode, is between about 5 to 55 psi. This level of adhesion is sufficient to prevent ingress of solvent solder, plating or coating materials but low enough to allow easy dry stripping mechanically or by hand.

    Abstract translation: 一种临时掩模组合物,其包含:(1)包含主要量的丙烯酸和封端的预聚物(ACRYL)mX的可辐射固化单体,(2)自由基光引发剂,(3)选自以下的减粘组分: i)脂肪醇的丙烯酸酯(I); (ii)其中ACRYL =(IV),x =聚合物残基或骨架,m> 2,n> 9,o> 8,以及(ii)脂肪酸的乙烯基酯(II)和(iii)聚环氧烷的单丙烯酸酯 R 3 = H或烷基。 还公开了一种用于提供与高速生产操作兼容的电子部件的暂时掩蔽的方法。 在拉伸剪切模式下测量时,固化的组合物(22)与基材(16)的粘合力合适地在约5至55psi之间。 这种附着水平足以防止溶剂焊料,镀层或涂层材料的进入,但足够低以允许机械或手工方便地进行干法剥离。

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