公开(公告)号：JP2001042232A

公开(公告)日：2001-02-16

申请号：JP2000178073

申请日：2000-06-14

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FORD JOSEPH EARL ,  KEITH WAIN GOOSEN ,  CHRISTIE K MADSEN ,  WALKER JAMES ALBERT

IPC: G02B26/06 ,  G02B5/28 ,  G02B6/34 ,  H04B10/02 ,  H04B10/18 ,  H04J14/00 ,  H04J14/02

Abstract: PROBLEM TO BE SOLVED: To provide a wide optical wavelength (WDM) communication system whose loss is low, whose polarity dependency is low and which realizes compensation over wide band width by providing an adjustable multichannel dispersion compensating fiber whose loss is low, whose polarity dependency is low and which has a function capable of compensating many channels over a wide wavelength range. SOLUTION: This WDM optical fiber communication system 10 is provided with a multiple wavelength light transmitter 11, an optical fiber for transmission 12, and the adjustable multichannel dispersion compensating fiber 13 for compensating the dispersion of the optical fiber 12. The fiber 13 is provided with a variable partial reflector 19, a fixing mirror 29 and an optical cavity 27 arranged on an optical path between the reflector 19 and the mirror 29. On parallel side surface 28 and the mirror 29 regulate the optical cavity having thickness L. The thickness L is selected so that a free spectral range(FSR) may be the integral multiple of space between the optical channels of the system. Thus, many channels are simultaneously compensated.

公开(公告)号：JPH10189661A

公开(公告)日：1998-07-21

申请号：JP34133697

申请日：1997-12-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： LEO MARIA SYROVSKI ,  JOHN EDWARD KUNINGAMU ,  LUCIAN ARTHUR DASARO ,  KEITH WAIN GOOSEN

IPC: H01L21/60 ,  G02B6/42 ,  H01L21/603 ,  H01L21/607 ,  H01L25/16 ,  H01L33/00

Abstract: PROBLEM TO BE SOLVED: To provide a bonding method which is high in reliability and yield. SOLUTION: A substrate structure which includes substrates of different thermal expansion coefficients is bonded together through a thermal compression bonding method, in this case e.g. an optical diode array or another semiconductor substrate 14 is bonded to a silicon substrate 38 by thermocompression for the formation of an electronic device or a photoelectric device. In this method, substrate structures 14 and 38 which are mutually connected together are aligned and brought into contact with each other. Then, contact pad elements 22, 24 and 42, 44 are thermocompressed at bonging temperatures. Thereafter, an encapsulating temperature is set. Encapsulating material is fed to the bonded substrate structures. Thereafter, the encapsulating material is hardened at an encapsulating temperature.