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公开(公告)号:JP2001335754A
公开(公告)日:2001-12-04
申请号:JP2000155736
申请日:2000-05-26
Applicant: MACDERMID INC
Inventor: FERRIER DONALD
Abstract: PROBLEM TO BE SOLVED: To provide a method for improving the adhesion of a polymeric material to metallic surfaces, which is suited in manufacturing multi-layer printed circuits. SOLUTION: This method for improving the adhesion of a polymeric material to metallic surfaces comprises (a) bringing an adhesion accelerating composition comprising (1) an oxidizing agent, (2) an acid, (3) a corrosion-resistant agent, (4) a benzotriazole having an electron-withdrawing group having stronger electron-withdrawing power than hydrogen group at the 1-position, and as an optional component, (5) at least one adhesion reinforcing seed source selected from the group consisting of a molybdate, a tungstate, a tantalate, a niobate, a vanadate, an isopolyacid and a heteropolyacid respectively of molybdenum, tungsten, tantalum, niobium, and vanadium into contact with a metallic surface, and then joining a polymeric material to the metallic surface.
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公开(公告)号:JPH1121517A
公开(公告)日:1999-01-26
申请号:JP16163298
申请日:1998-06-10
Applicant: MACDERMID INC
Inventor: FERRIER DONALD
IPC: C08J5/12 , B32B15/08 , C09J5/00 , C09J11/02 , C09J201/00 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/38 , H05K3/46
Abstract: PROBLEM TO BE SOLVED: To enhance the bonding of a polymeric material to a metallic surface by bringing an adhesion promoting composition comprising an oxidizing agent, an acid, a corrosion inhibitor, a halide ion source and optionally a water-soluble polymer into contact with the metallic surface and bonding the polymeric material to the metallic surface to thereby form a modified coated surface having fine irregularities and increased bondability on the metallic surface. SOLUTION: A composition comprising an oxidizing agent, desirably H2 O2 or a persulfate, an acid (e.g. sulfuric acid) desirably an inorganic acid, a corrosion inhibitor desirably being at least one member selected from among triazole, benzotriazole, imidazole, benzimidazole and tetrazole, a halide ion source desirably being an alkaline earth metal halide or oxohalide salt and optionally a water-soluble polymer desirably being at least one member selected from among ethylene oxide polymers, ethylene oxide/propylene oxide copolymers, polyethylene glycols, etc., is brought into contact with a metallic surface, and the metallic surface is bonded to a polymeric material.
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公开(公告)号:JP2000104177A
公开(公告)日:2000-04-11
申请号:JP19268299
申请日:1999-07-07
Applicant: MACDERMID INC
Inventor: FERRIER DONALD , DURSO FRANK
IPC: C08J5/12 , B32B15/08 , C09J5/00 , C09J11/02 , C09J201/00 , C23C22/40 , C23C22/48 , C23C22/52 , C23C22/60 , C23C22/63 , C23C22/73 , C23F1/18 , H05K3/38 , H05K3/46
Abstract: PROBLEM TO BE SOLVED: To increase the adhesive strength between a metal and a polymeric material by bringing the metal surface into contact with an adhesion promoting composition consisting of an oxidizing agent, an acid and a corrosion inhibitor, further a halide ion source, if necessary, and a water-soluble polymer, as required, and then with an alkaline soln. SOLUTION: The surface of copper is suitably treated with an acidic peroxide adhesion promoting composition and then with alkaline treatment. A minute coarse chemical conversion applied surface is formed on the metal by the composition, the adhesiveness of the formed surface is remarkably increased as compared with an untreated metal surface, and hence the surface is appropriately combined with a polymeric material. Further, the increased adhesion is kept on the applied surface over a long period, and the possibility that an undesirable reaction takes place between the metal and material is reduced over a long period. By such a treatment, the intermediate layer is combined with a prepreg or a picture formable dielectric, for example, to form a multilayer printed circuit board.
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公开(公告)号:JP2000234084A
公开(公告)日:2000-08-29
申请号:JP37329699
申请日:1999-12-28
Applicant: MACDERMID INC
Inventor: FERRIER DONALD
Abstract: PROBLEM TO BE SOLVED: To provide a method of improving adhesion of a polymer material to a metal surface and increasing peeling strength between the two material. SOLUTION: A metal surface is treated with an adhesion promoting composition containing an adhesion increasing ion source selected from the group consisting of oxidants, acids, corrosion inhibitors, halide ion sources, molybdates, tungstates, tantalates, niobates, vanadates and mixtures thereof and optionally a water-soluble polymer and a polymer material is bonded to the metal surface.
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5.
公开(公告)号:DE60142648D1
公开(公告)日:2010-09-02
申请号:DE60142648
申请日:2001-05-01
Applicant: MACDERMID INC
Inventor: FERRIER DONALD
IPC: C09D201/00 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/38
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公开(公告)号:ES2238687T3
公开(公告)日:2005-09-01
申请号:ES96300797
申请日:1996-02-06
Applicant: MACDERMID INC
Inventor: FERRIER DONALD , MARTINEZ ROSA , YAKOBSON ERIC
Abstract: SE PRESENTA LA MODIFICACION DE PARTICULAS DE CARBONO PARA CONSEGUIR UNA GALVANIZACION MEJORADA SOBRE UNA SUPERFICIE NO CONDUCTORA QUE HAYA SIDO PREVIAMENTE TRATADA CON LAS PARTICULAS DE CARBONO MODIFICADO. LA INVENCION ES PARTICULARMENTE UTIL PARA LA GALVANIZACION A TRAVES DE ORIFICIOS DE TARJETAS DE CIRCUITO IMPRESO.
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公开(公告)号:DE69634651D1
公开(公告)日:2005-06-02
申请号:DE69634651
申请日:1996-02-06
Applicant: MACDERMID INC
Inventor: FERRIER DONALD , MARTINEZ ROSA , YAKOBSON ERIC
Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has bee n previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
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公开(公告)号:AU2003272595A1
公开(公告)日:2004-06-18
申请号:AU2003272595
申请日:2003-09-19
Applicant: MACDERMID INC
Inventor: FERRIER DONALD
Abstract: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, an unsaturated alkyl substituted with an aromatic or non-aromatic cyclic groups, and optionally but preferably a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing, an organic nitro compound, and a source of halide ions in order to increase the adhesion of polymeric materials to the metal surface.
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公开(公告)号:ES2124965T3
公开(公告)日:1999-02-16
申请号:ES95305962
申请日:1995-08-25
Applicant: MACDERMID INC
Inventor: FERRIER DONALD , YAKOBSON ERIC
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公开(公告)号:ES2438528T3
公开(公告)日:2014-01-17
申请号:ES03754784
申请日:2003-09-19
Applicant: MACDERMID INC
Inventor: FERRIER DONALD
Abstract: Un proceso para aumentar la adhesión de un material polimérico a una superficie metálica, donde la superficiemetálica comprende cobre, comprendiendo dicho proceso: a) poner en contacto la superficie metálica con una composición promotora de adhesión que comprende: 1) agua oxigenada; 2) un ácido inorgánico; 3) un inhibidor de corrosión; 4) un alquilo insaturado sustituido con grupos cíclicos aromáticos o no aromáticos donde el alquilo insaturadoestá seleccionado entre el grupo que consiste en ácido cinámico, etinil ciclohexanol y 2-vinilpiridina; y 5) opcionalmente, pero preferentemente, al menos un material seleccionado entre el grupo que consiste en:(i) fuentes de iones haluro; (ii) compuestos orgánicos nitro; (iii) fuentes de especies que mejoran la adhesión, que están seleccionadas entre el grupo que consiste enmolibdatos, tungstatos, tantalatos, niobatos, vanadatos, isopoli o heteropoli ácidos de molibdeno,tungsteno, tántalo, niobio, vanadio y combinaciones de cualquiera de los anteriores; y b) unir el material polimérico a la superficie metálica.
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