公开(公告)号：AU6266794A

公开(公告)日：1994-11-21

申请号：AU6266794

申请日：1994-01-14

Applicant: MATERIALS RESEARCH CORP

Inventor： HSU JON SHAOCHUNG ,  DE BHOLA N ,  ROBISON RODNEY L ,  YASAR TUGRUL

IPC: G01B11/06 ,  G01J4/00 ,  G01J4/04 ,  G01N21/21 ,  H01L21/66

Abstract: An ellipsometric measuring system is set-up in association with a vacuum chamber on a production line for thin film samples. The ellipsometer has a scanner for directing the incident light beam to different locations on a thin film sample, and the ellipsometer also has an aperture for limiting the reflected light beam received by the photodetector. The scanner implements a method of aligning the incident beam to a selected surface of the sample. The scanner and the aperture are used to provide a finer adjustment of the incident beam with respect to the selected surface. The ellipsometric measuring system further uses test thin film samples with known film thicknesses and index or refractions to calculate a value for the angle of incidence of the incident light beam.

公开(公告)号：CA2137471A1

公开(公告)日：1994-01-06

申请号：CA2137471

申请日：1993-06-25

Applicant: MATERIALS RESEARCH CORP

Inventor： YASAR TUGRUL ,  ROBISON RODNEY L ,  DEYO DANIEL ,  ZIELINSKI MARIAN

IPC: B65G49/07 ,  H01L21/02 ,  H01L21/677 ,  H01L21/00

Abstract: A wafer processing system includes a plurality of evacuable housings connected in series to form a processing line, with a plurality of isolation valves to separately isolate the housings. A track extends through the connected housings. At least one wafer carrier is moveable on the track, through the housings and along the processing line. The wafer carrier holds wafers in vertical orientation and also includes a plurality of magnets aligned along its bottom. Outside the housings, a plurality of magnetic drive units are aligned parallel with the track, with one drive unit per housing. Each drive unit includes a motor driven conveyor with a plurality of magnets mounted thereon which imposes magnetic fields inside the housing to magnetically couple with the magnets mounted on the carrier. When the motor driven conveyor moves the imposed magnetic fields, the magnetic coupling causes the wafer carrier to move. A controller operatively connected to the isolation valves and the drive units coordinates movement of wafer carriers along the processing line according to a predetermined sequence while maintaining vacuum conditions in the housings.

公开(公告)号：CA2159831A1

公开(公告)日：1994-11-10

申请号：CA2159831

申请日：1994-01-14

Applicant: MATERIALS RESEARCH CORP

Inventor： HSU JON SHAOCHUNG ,  DE BHOLA N ,  ROBISON RODNEY L ,  YASAR TUGRUL

IPC: G01B11/06 ,  G01J4/00 ,  G01J4/04 ,  G01N21/21 ,  H01L21/66 ,  G01B11/26 ,  G01N21/41 ,  G01N21/43

Abstract: An ellipsometric measuring system is set up in association with a vacuum chamber on a production line for thin film samples. The ellipsometer (8) has a scanner (12) for directing the incident light beam to different locations on a thin film sample (11), and the ellipsometer also has an aperture (13) for limiting the reflected light beam (27) received by the photodetector (36). The scanner implements a method of aligning the incident beam to a selected surface of the sample. The scanner and the aperture are used to provide a finer adjustment of the incident beam with respect to the selected surface. The ellipsometric measuring system further uses test thin film samples with known film thickness and index or refractions to calculate a value for the angle of incidence of the incident light beam.

公开(公告)号：AU1550495A

公开(公告)日：1995-09-04

申请号：AU1550495

申请日：1994-11-28

Applicant: MATERIALS RESEARCH CORP

Inventor： HURWITT STEVEN D ,  YASAR TUGRUL ,  DE BHOLA N ,  HSU JON SHAOCHUNG

IPC: C23C14/34 ,  H01J37/34

Abstract: A sputtering target assembly in which the region of attachment between the sputtering target and the backing plate has varying stiffness, thereby reducing stresses in the target during sputtering. In the region of attachment, the backing plate has varying thickness, for example a smooth taper. Alternatively, the backing plate may include structures which affect the stiffness of the backing plate in the region of attachment. These structures may be defined by machining, molding or forging during manufacture of the backing plate, or by machining or drilling voids in the backing plate. As a second alternative, the bonding material used to attach the sputtering target and the backing plate may have a varying stiffness across the region of attachment.

公开(公告)号：AU4652993A

公开(公告)日：1994-01-24

申请号：AU4652993

申请日：1993-06-25

Applicant: MATERIALS RESEARCH CORP

Inventor： YASAR TUGRUL ,  ROBISON RODNEY LEE ,  DEYO DANIEL ,  ZIELINSKI MARIAN

IPC: B65G49/07 ,  H01L21/02 ,  H01L21/677 ,  H01L21/00

Abstract: A wafer processing system includes a plurality of evacuable housings connected in series to form a processing line, with a plurality isolation valves to separately isolate the housings. A track extends through the connected housings. At least one wafer carrier is moveable on the track, through the housings and along the processing line. The wafer carrier holds wafers in vertical orientation and also includes a plurality of magnets aligned along its bottom. Outside the housings, a plurality of magnetic drive units are aligned parallel with the track, with one drive unit per housing. Each drive unit includes a motor driven conveyor with a plurality of magnets mounted thereon which imposes magnetic fields inside the housing to magnetically couple with the magnets mounted on the carrier. When the motor driven conveyor moves the imposed magnetic fields, the magnetic coupling causes the wafer carrier to move. A controller operatively connected to the isolation valves and the drive units coordinates movement of wafer carriers along the processing line according to a predetermined sequence while maintaining vacuum conditions in the housings.

公开(公告)号：SG47541A1

公开(公告)日：1998-04-17

申请号：SG1996002717

申请日：1993-06-25

Applicant: MATERIALS RESEARCH CORP

Inventor： ZIELINSKI MARIAN ,  DEYO DANIEL ,  ROBISON RODNEY LEE ,  YASAR TUGRUL

IPC: B65G49/07 ,  H01L21/02 ,  H01L21/677 ,  H01L21/00

Abstract: A wafer processing system includes a plurality of evacuable housings connected in series to form a processing line, with a plurality isolation valves to separately isolate the housings. A track extends through the connected housings. At least one wafer carrier is moveable on the track, through the housings and along the processing line. The wafer carrier holds wafers in vertical orientation and also includes a plurality of magnets aligned along its bottom. Outside the housings, a plurality of magnetic drive units are aligned parallel with the track, with one drive unit per housing. Each drive unit includes a motor driven conveyor with a plurality of magnets mounted thereon which imposes magnetic fields inside the housing to magnetically couple with the magnets mounted on the carrier. When the motor driven conveyor moves the imposed magnetic fields, the magnetic coupling causes the wafer carrier to move. A controller operatively connected to the isolation valves and the drive units coordinates movement of wafer carriers along the processing line according to a predetermined sequence while maintaining vacuum conditions in the housings.