Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a PZT thin film, by which a PZT thin film high in orientation can be easily manufactured, a low cost BAW resonator having the PZT thin film high in orientation as a piezoelectric thin film, and a filter for UWB using the resonator. SOLUTION: In the manufacturing of the PZT thin film 30a, the PZT thin film 30a is formed through crystal growth by a sputtering method comprising irradiating the outermost surface Sur being a growth surface on the main surface side of a substrate 1 for crystal growth with an electron beam emitted from an electron gun 2. Thereby, the PZT thin film 30a which is high in orientation and in which the direction of spontaneous polarization is made uniform can be formed through crystal growth by the interaction between the electric field caused by electrons 4 in the vicinity of the outermost surface Sur and the spontaneous polarization of PZT particles 3 sputtered toward the outermost surface Sur during crystal growth. If the method for manufacturing the PZT thin film 30a is utilized as a method for forming a piezoelectric thin film for the BAW resonator, the BAW resonator and the filter for UWB can be obtained at low cost. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a piezoelectric sound wave sensor more improved in sensing sensitivity than heretofore. SOLUTION: It is considered that parts of a lower electrode 3, a piezoelectric film 4, an upper electrode 5, and an oxide film 6 existing on the surface of a diaphragm part 1 give the effect of the residual stress on the bent of the diaphragm part 1 and parts of the lower electrode 3, the piezoelectric film 4, the upper electrode 5, and the oxide film 6 give less effect thereon. Thus, provision of the upper electrode 5 and the piezoelectric film 4 on the surface of the diaphragm part 1 within a range narrower than the diaphragm part 1 reduces the effect of the residual stress of the upper electrode 5 and the piezoelectric film 4 given onto the diaphragm part 1 in comparison with prior arts wherein the upper electrode 5 and the piezoelectric film 4 are provided to the same area as that of the diaphragm part 1 or to an area broader than the diaphragm part 1 so that the diaphragm part 1 can easily be bent, resulting in that the sensing sensitivity of the piezoelectric sound wave sensor can be enhanced more than that of prior arts. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To reduce optical propagation loss in the optical path along the substrate thickness direction of an optic/electric mixed mounting substrate. SOLUTION: An optic/electric mixed mounting substrate 1 is provided with an electric wiring 3 which is formed on the surface of a substrate 2, an optical wiring (a waveguide core) 4 which is formed inside the substrate 2, a vertical direction waveguide 5 which guides optical signals along the thickness direction of the substrate 2 and an optical path changing structure 6 which is used to optically couple the optical wiring 4 and the vertical direction waveguide 5. The vertical direction waveguide 5 is formed by conducting partial material reform at a point P where laser light beams LB are irradiated using the electric wiring 3 as a reference for positioning. The optical path changing structure 6 is formed in a similar manner as in the case of the vertical direction waveguide 5. The vertical direction waveguide 5 is formed without conducting a mechanical elimination process and a material filling process. Therefore, the optic/electric mixed mounting substrate, in which conventional optical propagation loss caused by bubble generation due to resin filling and resin hardening deformation or the like is reduced, is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a bidirectional optical transmission device that transmits and receives optical signals in two directions by using a single core optical fiber as a transmission medium, the optical transmission device being capable of suppressing interference and crosstalk between an optical signal transmitted to the outside through the optical fiber and an optical signal transmitted from the optical fiber. SOLUTION: The optical fiber has in a clad 4 a light-reception-side core 3b where the optical signal incident from the optical fiber 11 is guided and a light-emission-side core 3a where the optical signal incident on the optical fiber 11 is guided. The light-reception-side core 3b is separated from the light-emission-side core 3a. Thus, the structure of separating the light-reception-side core 3b from light-emission-side core 3a can prevent the transmit and receive signals from interfering with each other. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To reduce a popcorn noise being generated by thermal stress and stress concentration without increasing cost. SOLUTION: A pyroelectric chip 1 is nearly octagonal, and electrodes 40a, 40b, 41a, and 41b are formed on front and reverse surfaces along two opposing sides, thus reducing the contact area between a circuit side substrate and a support part and decreasing the occurrence of thermal stress on the pyroelectric chip. Also, by forming a corner part 1a at both sides that do not include the two sides in a circular shape, the occurrence of chipping and microcrack that frequently is generated at the corner part la on cutting from the pyroelectric wafer is prevented.
Abstract:
PURPOSE: To provide an acceleration sensor having a simple structure, easy to manufacture, having an improved yield, and capable of mass-produced. CONSTITUTION: A ferroelectric substance 5 movable in the plane direction of electrodes is arranged between a pair of flat plate-like upper electrode 1 and lower electrode 2 faced to each other. The prescribed voltage is applied between the upper electrode 1 and the lower electrode 2. The change of the electrostatic capacity between the upper electrode 1 and the lower electrode 2 is captured to detect acceleration when the ferroelectric substance 5 jumps out to the outside from the gap between the upper electrode 1 and the lower electrode 2.
Abstract:
PURPOSE: To obtain a semiconductor acceleration sensor which can be used in a high-temperature region by using a thermistor instead of a piezo resistor and in which the temperature compensation is not required by always maintaining the surrounding temperature of a cantilever constant. CONSTITUTION: The semiconductor acceleration sensor comprises a cantilever 6 formed on a silicon wafer, and a pair of heaters (an upper heater 4 and a lower heater 5) made of a thermistor 7 formed on the cantilever 6, so disposed as to sandwich the cantilever 6 therebetween, disposed as to oppose via a predetermined distance and formed with a predetermined temperature gradient.
Abstract:
PURPOSE: To provide a structure of a small humidity sensor which eliminates the need for maintenance work such as thermal refreshing and has high measuring accuracy and short response time. CONSTITUTION: This ultrasonic humidity sensor has a plurality of vibrators 11a to 11e differing in resonance frequency, uses the vibrators 11 a to 11e in transmitting and receiving ultrasonic waves, and uses a signal processing circuit portion 14 to perform signal processing such as amplification and then measure the damping rates of the ultrasonic waves of different frequencies, thereby measuring the humidity of gas. Also, the sensor measures the temperature of the gas by measuring the propagation time of the ultrasonic waves. The use of the plural ultrasonic waves of different frequencies eliminates the need for maintenance work such as thermal refreshing and results in enhanced measuring accuracy and reduced response time.
Abstract:
PURPOSE:To obtain the vibration detection device which can be made high in sensitivity without causing the curvature of a cantilever and the peeling of a lower electrode and the manufacturing method which shortens the manufacture time and reduces the cost. CONSTITUTION:An intermediate insulating film 5 is formed completely covering a piezoelectric thin film 4 and the lower electrode 3 and also eliminating the exposed part of the piezoelectric thin film 3 and lower electrode 3, and an opening 5a which electrically connects an upper electrode 6 and the piezoelectric thin film 4 together is formed. The upper electrode 6 is formed entirely from the base to the tip part of the cantilever 13.
Abstract:
PURPOSE:To obtain a permanent magnet having excellent magnetic characteristics with good workability at a low cost by bonding magnetic alloy powder or rear earths-iron-boron having high coercive force and large orientation degree of magnetic fields by a binder. CONSTITUTION:A thin strip of 50-60mum thickness is produced from an R-Fe-B (R is rear earths) alloy(for example, Nd13Fe82B5). This thin strip is roughly ground to 50mum average grain size and is further pulverized to, for example, 3mum average grain size by a ball mill. The fine powder obtd. in such a manner is heat-treated together with a reducing agent consisting of metal, for example, Ca at 600-800 deg.C. The magnetic powder obtd. by separating the Ca after this heat treatment is pressed in a magnetic field and is bonded by a binder consisting of an epoxy resin, etc. The high-performance bonded magnet having larger orientation degree than heretofore is thereby obtd.