公开(公告)号：EP2878705B1

公开(公告)日：2017-06-14

申请号：EP13762721.2

申请日：2013-03-04

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami

IPC: C23F1/18 ,  H05K3/38 ,  C23F1/34

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A% by weight and a concentration of the polymer is B% by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract translation: 公开了一种用于铜的微蚀刻溶液，其补充溶液以及用于制造接线板的方法。 本发明的微蚀刻剂溶液由含有铜离子，有机酸，卤化物离子，分子量为17至400的含氨基化合物和聚合物的水溶液组成。 该聚合物是包含多胺链和/或阳离子基团且具有1000或更高的重均分子量的水溶性聚合物。 当含氨基化合物的浓度为A重量％且聚合物的浓度为B重量％时，本发明的微蚀刻剂溶液的A / B值为50至6000.根据本发明 即使蚀刻量少，也能够维持铜与树脂等的密合性。

公开(公告)号：EP2878706B1

公开(公告)日：2016-11-09

申请号：EP13804745.1

申请日：2013-06-25

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami ,  OGINO, Yuki

IPC: C23F1/18 ,  H01L21/308 ,  H05K3/38

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

公开(公告)号：EP2878706A1

公开(公告)日：2015-06-03

申请号：EP13804745.1

申请日：2013-06-25

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami ,  OGINO, Yuki

IPC: C23F1/18 ,  H01L21/308 ,  H05K3/38

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/ or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A% by weight, a concentration of the polymer is B% by weight and a concentration of the nonionic surfactant is D% by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 本发明提供一种微蚀刻剂，补充溶液加入到所述微蚀刻剂和用于生产使用所述微蚀刻剂的布线板的制造方法。 用于水溶液含有铜离子的有机酸，卤化物离子，聚合物和非离子表面活性的铜besteht的微蚀刻剂。 该聚合物是一种水溶性聚合物包含聚胺链和/或阳离子基团，并且具有1,000或更高的重均分子量。 在本发明的微蚀刻剂，A / B的值是2000到9000和A / D为500〜9000，其中所述卤化物离子的浓度按重量计为A％的值，该聚合物的浓度为 B％（重量），非离子表面活性剂的浓度为D％（重量）。 使用该微蚀刻溶液，粘接性树脂等能够即使在低蚀刻量被均匀地保持。

公开(公告)号：EP2878705A1

公开(公告)日：2015-06-03

申请号：EP13762721.2

申请日：2013-03-04

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami

IPC: C23F1/18 ,  H05K3/38

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A% by weight and a concentration of the polymer is B% by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract translation: 公开了一种用于铜微蚀刻剂，其的补充溶液以及用于生产接线板的方法。 的水溶液含有铜离子的有机酸，卤化物离子的本发明besteht的微蚀刻剂，对氨基具有17至400和聚合物的分子量基团的化合物。 该聚合物是一种水溶性聚合物包含聚胺链和/或阳离子基团，并且具有1,000或更高的重均分子量。 重量当含氨基的化合物的浓度是按重量计，并且聚合物的浓度A％是B％，本发明的微蚀刻剂的A / B的值是50到6000。根据本 发明中，对铜和树脂或类似物之间的粘附性可以甚至具有低蚀刻量被维持。