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1.发明公开
公开(公告)号：EP2514853A3
公开(公告)日：2014-11-05
申请号：EP12002463.3
申请日：2012-04-05
Applicant: MEC COMPANY LTD.
Inventor： Sengoku, Yoichi , Tsutae, Yoichi , Tai, Kiyoto , Joko, Keisuke , Amatani, Tsuyoshi
CPC classification number: C23C22/52 , C23C18/1689 , C23C22/68 , H05K3/0079 , H05K3/108 , H05K2203/124
Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25°C, and a salt thereof, has a pH of more than 4 and not more than 7 at 25°C, and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
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2.发明公开Coating-forming liquid composition and coating-forming method therewith 有权BeschichtungsbildendeFlüssigkeitszusammensetzungund beschichtungsbildendes Verfahren damit
公开(公告)号：EP2514853A2
公开(公告)日：2012-10-24
申请号：EP12002463.3
申请日：2012-04-05
Applicant: MEC COMPANY LTD.
Inventor： Sengoku, Yoichi , Tsutae, Yoichi , Tai, Kiyoto , Joko, Keisuke , Amatani, Tsuyoshi
CPC classification number: C23C22/52 , C23C18/1689 , C23C22/68 , H05K3/0079 , H05K3/108 , H05K2203/124
Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25°C, and a salt thereof, has a pH of more than 4 and not more than 7 at 25°C, and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
Abstract translation: 本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，酸解离常数的倒数的对数 在25℃下为3〜8，其盐在25℃下的pH值大于4且不大于7，即使连续使用也能稳定地形成用于提高铜和感光性树脂之间的粘附性的涂层 或反复; 以及形成用于将铜粘合到感光性树脂上的涂层的方法，其包括使铜的表面与涂布液组合物接触以形成涂层。
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3.发明授权
公开(公告)号：EP2514853B1
公开(公告)日：2016-02-10
申请号：EP12002463.3
申请日：2012-04-05
Applicant: MEC COMPANY LTD.
Inventor： Sengoku, Yoichi , Tsutae, Yoichi , Tai, Kiyoto , Joko, Keisuke , Amatani, Tsuyoshi
CPC classification number: C23C22/52 , C23C18/1689 , C23C22/68 , H05K3/0079 , H05K3/108 , H05K2203/124
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