公开(公告)号：EP4245886A1

公开(公告)日：2023-09-20

申请号：EP21891519.7

申请日：2021-09-30

Applicant: MEC COMPANY., LTD.

Inventor： FUKUI Yu ,  AKIYAMA Daisaku ,  NAKANE Dai ,  NISHIE Kenji

IPC: C23F1/14 ,  H01L21/308 ,  H05K3/06

Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.