公开(公告)号：AU3074399A

公开(公告)日：1999-09-27

申请号：AU3074399

申请日：1999-03-10

Applicant: MEDALLION TECHNOLOGY LLC

Inventor： GARCIA STEVE

IPC: H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rests on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).

公开(公告)号：CA2322468C

公开(公告)日：2004-01-13

申请号：CA2322468

申请日：1999-03-10

Applicant: MEDALLION TECHNOLOGY LLC

Inventor： GARCIA STEVE

IPC: H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rest on the seating portion (403) o f the leads (302) of the integrated circuit (300), and so that the stem portio n (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) havin g the leads (302) therein, and cured to form a solid, electrical, and mechanic al connection between the printed circuit board (400) and integrated circuit (300).

公开(公告)号：AU743640B2

公开(公告)日：2002-01-31

申请号：AU3074399

申请日：1999-03-10

Applicant: MEDALLION TECHNOLOGY LLC

Inventor： GARCIA STEVE

IPC: H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/02

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rests on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).

公开(公告)号：CA2322468A1

公开(公告)日：1999-09-16

申请号：CA2322468

申请日：1999-03-10

Applicant: MEDALLION TECHNOLOGY LLC

Inventor： GARCIA STEVE

IPC: H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/02 ,  H05K3/36

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rest on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).

公开(公告)号：WO9946965A3

公开(公告)日：1999-12-09

申请号：PCT/US9905167

申请日：1999-03-10

Applicant: MEDALLION TECHNOLOGY LLC

Inventor： GARCIA STEVE

IPC: H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/02

CPC classification number: H01L23/49811 ,  H01L24/29 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/10704 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rest on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).

Abstract translation: 提供了用于电子和机械互连电子电路组件或电子模块的方法和设备。 集成电路（300）包括从表面（305）延伸的多个引线（302），每个引线（302）具有底座部分（403）和杆部分（402）。 印刷电路板（400）包括对应于从集成电路（300）延伸的多个引线（302）的多个电镀通孔（401）。 该方法的步骤包括定位印刷电路板（400），使得印刷电路板（400）的下表面（404）搁置在集成电路（300）的引线（302）的底座部分（403） ），并且使得每条引线的杆部（302）定位在印刷电路板（400）中的相应的电镀通孔（401）内。 然后将导电环氧树脂粘合剂（602）分配到其中具有引线（302）的孔（401）中，并固化以在印刷电路板（400）和集成电路（300）之间形成固体，电气和机械连接 ）。

公开(公告)号：EP1062848A4

公开(公告)日：2006-05-31

申请号：EP99912352

申请日：1999-03-10

Applicant: MEDALLION TECHNOLOGY LLC

Inventor： GARCIA STEVE

IPC: H05K1/00 ,  H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

CPC classification number: H01L23/49811 ,  H01L24/29 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/10704 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rest on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).

Abstract translation: 提供了一种用于电和机械地相互连接的电子电路组件或电子模块的方法和装置。 一种集成电路（300）包括从表面（305）延伸的引线（302）的复数，每个具有一个底座部分（403）和杆部（402）的引线（302）的。 一种印刷电路板（400）包括通孔（401）镀敷的多元性。其中对应于引线的从集成电路（300）跨多个（302）。 该方法的步骤包括：印刷电路板（400）定位为做在印刷电路板（400）的下表面（404）搁置在集成电路的引线（302）的座部（403）（300 ）等没有每个引线的所述杆部（302）的内通孔（401）（在印刷电路板400）对应的镀定位。 然后导电环氧树脂粘接剂（602）被分配到具有引线（302）中的孔（401）在其中，并且被固化以形成印刷电路板（400）和集成电路之间的固体，电气和机械连接（300 ）。