公开(公告)号：AU3053502A

公开(公告)日：2002-06-11

申请号：AU3053502

申请日：2001-11-29

Applicant: MICROASSEMBLY TECHNOLOGIES INC

Inventor： COHN MICHAEL B ,  XU JI-HAI

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01H59/00

Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.

公开(公告)号：WO0244033A3

公开(公告)日：2002-12-12

申请号：PCT/US0145132

申请日：2001-11-29

Applicant: MICROASSEMBLY TECHNOLOGIES INC

Inventor： COHN MICHAEL B ,  XU JI-HAI

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01H59/00 ,  H01H57/00

CPC classification number: H01H59/0009 ,  B81B7/0077 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/093 ,  B81C1/00301 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01H2059/0018 ,  H01H2059/0072

Abstract: A MEMS device (400) and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly (220) comprising a movable structure (230) bearing a contact pad (234). The base assembly (220) is wafer-scale bonded to a lid assembly (202) comprising an activator (210), and a signal path. The movable structure (230) moves within a sealed cavity (238) formed during the bonding process. The signal path includes an input line (300) and an output line (302) separated by a gap (308), which prevent signals from propagating through the micro-switch (400) when the switch (400) is deactivated. In operation, a signal is launched into the signal path. When the micro-switch (400) is activated, a force (402) is established by the actuator (210), which pulls a portion of the movable structure (230) upwards towards the gap (308) in the signal path, until the contact pad (234) bridges the gap between the input line (300) and output line (302), allowing the signal to propagate through the micro-switch (400). Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.

Abstract translation: 公开了一种MEMS器件（400）及其制造方法。 在一个实施例中，微型开关包括基部组件（220），其包括承载接触垫（234）的可移动结构（230）。 基座组件（220）被晶片刻度地结合到包括激活器（210）的盖组件（202）和信号路径。 可移动结构（230）在接合过程中形成的密封空腔（238）内移动。 信号路径包括输入线（300）和由间隙（308）分开的输出线（302），当开关（400）被停用时，该线路防止信号通过微型开关（400）传播。 在操作中，信号被发送到信号路径中。 当微动开关（400）被激活时，致动器（210）建立力（402），致动器（210）将可移动结构（230）的一部分朝向信号路径中的间隙（308）向上拉动，直到 接触焊盘（234）桥接输入线（300）和输出线（302）之间的间隙，允许信号传播通过微型开关（400）。 在结合之前，MEMS结构在第一晶片上退火，并且导电迹线和其它金属在第二晶片上进行退火，以允许使用不同工艺（例如不同的退火温度）分别对每个晶片进行加工。