公开(公告)号：WO2021071552A1

公开(公告)日：2021-04-15

申请号：PCT/US2020/028261

申请日：2020-04-15

Applicant: MICROCHIP TECHNOLOGY INC.

Inventor： KLEIN, Matthias ,  ZAKRZEWSKI, Andreas ,  GRUENWALD, Richard

IPC: B81C1/00

Abstract: A packaged electronic die having a micro-cavity and a method for forming a packaged electronic die. The packaged electronic die includes a photoresist frame secured to the electronic die and extending completely around the device. The photoresist frame is further secured to a first major surface of a substrate so as to form an enclosure around the device. Encapsulant material extends over the electronic die and around the sides of the electronic die. The encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.