公开(公告)号：WO2021141631A1

公开(公告)日：2021-07-15

申请号：PCT/US2020/041216

申请日：2020-07-08

Applicant: MICROCHIP TECHNOLOGY INC.

Inventor： MCCANN, Damian

IPC: H01L23/367 ,  H01L2223/6655 ,  H01L2223/6683 ,  H01L23/3677 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/66 ,  H01L24/10 ,  H01L25/16 ,  H01L25/18

Abstract: A thermal management package for a semiconductor device includes a high dielectric constant material substrate, a high thermal conductivity slug disposed in a first window in the high dielectric constant material substrate and held therein by a first bonding material, an outer substrate formed from a material having a low dielectric constant and having a second window formed therein, the high dielectric constant material substrate disposed in the second window in the low dielectric constant outer substrate and held therein by a second bonding material.