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公开(公告)号：WO2020204981A1
公开(公告)日：2020-10-08
申请号：PCT/US2019/044861
申请日：2019-08-02
Applicant: MICROCHIP TECHNOLOGY INC.
Inventor： YAP, Matthew Kian Chin , NAKAMOTO, Alan
IPC: H03K19/177
Abstract: An integrated circuit includes a plurality of logic function circuits disposed on the integrated circuit and interconnected by metal interconnect lines to form a logic network. A plurality of configurable logic function circuits is also disposed on the integrated circuit, each configurable logic function circuit being disposed on a respective area on the integrated circuit and not interconnected by the metal interconnect lines to form the logic network.
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