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公开(公告)号：WO1993003197A1
公开(公告)日：1993-02-18
申请号：PCT/US1992006782
申请日：1992-08-07
Applicant: MICROELECTRONICS AND COMPUTER TECHNOLOGY ...
IPC: C23C18/08
Abstract: The field of the invention is laser-induced direct copper writing. The problem is crystallization of the initially amorphous copper formate films upon drying. The problem is solved by copper formate precursor solutions that contain a crystallization-inhibiting agent selected from glycerol, citric acid, malic acid, malonic acid and glycine. The principal use is direct copper writing of thin conductive links or traces on microelectronic substrates.
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