公开(公告)号：WO1996025839A1

公开(公告)日：1996-08-22

申请号：PCT/US1996002139

申请日：1996-02-16

Applicant: MICROMODULE SYSTEMS, INC. ,  MOK, Sammy, L.

Inventor： MICROMODULE SYSTEMS, INC.

IPC: H05K07/20

CPC classification number: H05K7/1061 ,  H01L23/4006 ,  H01L23/552 ,  H01L24/73 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A mounting assembly for a multiple chip module (13) or other circuit module, which includes a board (11) having a surface including an array of board contacts (22) such as a printed wiring board in a computer system. A circuit module, such as multiple chip module (13), having a first surface and a second surface is included. The circuit module includes an array of circuit contacts (23) on the first surface of the module. An interposer (12) between the board (11) and the first surface of the circuit module, includes conductors (21) between the circuit contacts in the array of circuit contacts (23) on the circuit module and board contacts in the array of board contacts (22) on the board. A thermal bridge member (15) contacts the second surface of the circuit module.

Abstract translation: 一种用于多芯片模块（13）或其它电路模块的安装组件，其包括具有包括计算机系统中的诸如印刷线路板之类的板触点（22）阵列的表面的板（11）。 包括具有第一表面和第二表面的诸如多芯片模块（13）的电路模块。 电路模块包括在模块的第一表面上的电路触点阵列（23）。 电路板（11）和电路模块的第一表面之间的插入件（12）包括在电路模块上的电路触点（23）阵列中的电路触点之间的导体（21）和板阵列中的板触点 触点（22）在板上。 热桥构件（15）接触电路模块的第二表面。

公开(公告)号：WO1997028675A1

公开(公告)日：1997-08-07

申请号：PCT/US1997001156

申请日：1997-01-27

Applicant: MICROMODULE SYSTEMS, INC.

Inventor： MICROMODULE SYSTEMS, INC. ,  MOK, Sammy, L.

IPC: H05K07/20

CPC classification number: H01L23/5385 ,  H01L23/4006 ,  H01L24/73 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/325 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An assembly for electronic components having heat spreaders (11, 17) on two sides comprises a mother board (13) on which to mount electronic components, having a top side with an array of board contacts. A multiple chip integrated circuit module (16) carries integrated circuits. The multiple chip module consists of a first substrate, such as aluminum, with a multi-layer interconnect structure on one surface of the aluminum substrate. The integrated circuits are mounted on the interconnect structure on the first substrate. A second substrate manufactured using printed wiring board technology, surrounds the first substrate, and includes an interconnect structure and an array of circuit contacts. Conductors connect the interconnect structure on the first substrate with the interconnect structure (31) on the second substrate. A thermally conductive beseplate (32) is coupled with the multiple chip module on the side opposite the array of circuit contacts. An interposer (15) providing electrical connection between the array of circuit contacts on the multiple chip module and the array of board contacts on the printed wiring board is placed between the multiple chip module and the board.

Abstract translation: 一种在两侧具有散热器（11,17）的电子部件组件包括：母板（13），用于安装电子元件，其上侧具有一组板触点。 多芯片集成电路模块（16）承载集成电路。 多芯片模块由诸如铝的第一衬底组成，在铝衬底的一个表面上具有多层互连结构。 集成电路安装在第一基板上的互连结构上。 使用印刷线路板技术制造的第二基板围绕第一基板，并且包括互连结构和电路触点阵列。 导体将第一基板上的互连结构与第二基板上的互连结构（31）连接。 导热套管（32）与多个芯片模块在与电路触点阵列相对的一侧耦合。 在多个芯片模块上的电路触头阵列与印刷电路板上的电路板触点阵列之间提供电连接的插入器（15）被放置在多个芯片模块和板之间。

公开(公告)号：WO1994012887A1

公开(公告)日：1994-06-09

申请号：PCT/US1993011002

申请日：1993-11-18

Applicant: MICROMODULE SYSTEMS, INC.

Inventor： MICROMODULE SYSTEMS, INC. ,  AGAHDEL, Fariborz ,  GRISWOLD, Brad ,  HUSAIN, Syed ,  MOTI, Robert ,  ROBINETTE, William, C. ,  HO, Chung, W.

IPC: G01R01/04

CPC classification number: G01R31/2884 ,  G01R1/0483 ,  H01L2224/49171 ,  H01L2924/01014 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A semiconductor die carrier (10) is provided for testing semiconductor circuits, the carrier (10), containing: a substrate (16) defining an opening and an outer perimeter (16); I/O pads (18) about the perimeter and an interconnect circuit (37) which includes individual electrical conductors formed in a polymer dielectric. The interconnect circuit overlays a top surface of the substrate and extends across the opening to form a flexible membrane (20) that spans the opening. Die contact pads connected to the conductors are disposed about the membrane with particles deposited on the die contact pads. A fence (23) upstanding from the membrane (20) and sized to receive a test die (22); a top cap (12) that rests upon the die when the die is received within the fence, a bottom cap (14) that rests against a bottom surface of the substrate; and a fastener (30) for securing the top cap to the bottom cap with the die in between are also provided.

Abstract translation: 提供半导体管芯载体（10）用于测试半导体电路，所述载体（10）包含：限定开口和外周边（16）的基板（16）; 围绕周边的I / O焊盘（18）和包括形成在聚合物电介质中的各个电导体的互连电路（37）。 互连电路覆盖衬底的顶表面并延伸穿过开口以形成跨越开口的柔性膜（20）。 连接到导体的模接触垫被布置在膜周围，颗粒沉积在模具接触垫上。 从所述膜（20）直立并且尺寸适于接收测试模具（22）的围栏（23）; 当模具被容纳在栅栏内时，顶盖（12）放置在模具上;底盖（14），其靠在基板的底表面上; 还提供了用于将顶盖固定到底盖上的紧固件（30），其中模具在其间。