公开(公告)号：WO1996024944A1

公开(公告)日：1996-08-15

申请号：PCT/US1996001657

申请日：1996-02-08

Applicant: MICRON DISPLAY TECHNOLOGY, INC.

Inventor： MICRON DISPLAY TECHNOLOGY, INC. ,  CATHEY, David, A. ,  GOCHNOUR, Derek ,  WATKINS, Charles

IPC: H01J09/26

CPC classification number: H01L25/50 ,  H01J9/241 ,  H01J9/261 ,  H01J9/32 ,  H01J9/36 ,  H01J2329/8625 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H05K3/328 ,  H05K3/368 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads (72). The method includes adjusting a wire bonder's tear length to a setting which leaves a projecting tail (80) of severed bond wire at a terminating wedge bond connection. Further steps include making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder, and then severing the bond wire adjacent said wedge bond. The adjusted tear length of the wire bonder results in a tail of severed bond wire which projects from said wedge bond and said individual bond pad. Subsequent steps include positioning the first and second planar substrates with their inwardly-facing surfaces facing each other, aligning the matching bond pad patterns of the first and second planar substrates, and pressing the first and second planar substrates against each other. The bond wire tail (80) deforms between the bond pads of the first and second planar substrates to conductively bond therebetween.

Abstract translation: 本公开描述了一种附接和电连接第一和第二平面基板的方法，其中第一和第二基板具有具有匹配图案的接合焊盘（72）的向内表面。 该方法包括将引线接合器的撕裂长度调整到在终止楔形结合连接处留下断开的接合线的突出尾部（80）的设置。 进一步的步骤包括使用与引线接合器的接合线将第一平面基片的单个接合焊盘楔合，然后切断邻近所述楔形键的接合线。 引线接合器的经调整的撕裂长度导致从所述楔形键和所述单独接合焊盘突出的断开的接合线的尾部。 随后的步骤包括将第一和第二平面基板定位成其面向彼此的向内表面，使第一和第二平面基板的匹配接合焊盘图案对准，并将第一和第二平面基板相互按压。 接合线尾（80）在第一和第二平面基板的接合焊盘之间变形，以在它们之间导电地结合。

公开(公告)号：EP0808508A1

公开(公告)日：1997-11-26

申请号：EP96906318.0

申请日：1996-02-08

Applicant: MICRON DISPLAY TECHNOLOGY, INC.

Inventor： CATHEY, David, A. ,  GOCHNOUR, Derek ,  WATKINS, Charles

IPC: H01J9 ,  H01L21 ,  H01L23 ,  H05K3

CPC classification number: H01L25/50 ,  H01J9/241 ,  H01J9/261 ,  H01J9/32 ,  H01J9/36 ,  H01J2329/8625 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H05K3/328 ,  H05K3/368 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads (72). The method includes adjusting a wire bonder's tear length to a setting which leaves a projecting tail (80) of severed bond wire at a terminating wedge bond connection. Further steps include making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder, and then severing the bond wire adjacent said wedge bond. The adjusted tear length of the wire bonder results in a tail of severed bond wire which projects from said wedge bond and said individual bond pad. Subsequent steps include positioning the first and second planar substrates with their inwardly-facing surfaces facing each other, aligning the matching bond pad patterns of the first and second planar substrates, and pressing the first and second planar substrates against each other. The bond wire tail (80) deforms between the bond pads of the first and second planar substrates to conductively bond therebetween.