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公开(公告)号:DE60228685D1
公开(公告)日:2008-10-16
申请号:DE60228685
申请日:2002-05-16
Applicant: MICRONIT MICROFLUIDICS BV
IPC: B81B1/00 , B01L3/00 , B81C1/00 , G01N33/487
Abstract: The invention relates to a microfluidic device comprising: a substrate provided with a fluid channel; a plurality of electro osmotic flow drive sections for providing electro osmotic flow in the channel, each drive section comprising electric field electrodes, exposed to the channel, and one or more gate electrodes, separated from the channel by an insulating layer, and control means connected to said electrodes of each drive section so as to control the direction of the electro osmotic flow in the channel.
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公开(公告)号:AT407096T
公开(公告)日:2008-09-15
申请号:AT02076937
申请日:2002-05-16
Applicant: MICRONIT MICROFLUIDICS BV
IPC: B81B1/00 , B01L3/00 , B81C1/00 , G01N33/487
Abstract: The invention relates to a microfluidic device comprising: a substrate provided with a fluid channel; a plurality of electro osmotic flow drive sections for providing electro osmotic flow in the channel, each drive section comprising electric field electrodes, exposed to the channel, and one or more gate electrodes, separated from the channel by an insulating layer, and control means connected to said electrodes of each drive section so as to control the direction of the electro osmotic flow in the channel.
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公开(公告)号:CA2428980A1
公开(公告)日:2003-11-16
申请号:CA2428980
申请日:2003-05-16
Applicant: MICRONIT MICROFLUIDICS BV
IPC: B01L3/00 , B81B1/00 , B81C1/00 , G01N33/487 , C03C27/02 , C23F1/00 , C09K13/00 , C23C16/06 , B32B15/08
Abstract: The present invention relates to a method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising tho steps of: a) etching at least a channel and one or more fluid ports in a first and/or a second substrate; b) depositing a first layer on a surface of the second substrate; c) partially removing the first layer in accordance with a predefined geometry; d) depositing a second layer on top of the first layer and the substrate surface; e) planarizing the second layer so as to smooth the upper surface thereof; f) aligning the first end second substrate; g) bonding the first substrate on the planarized second layer of the second substrate.
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