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公开(公告)号:JPH1159900A
公开(公告)日:1999-03-02
申请号:JP22690997
申请日:1997-08-22
Applicant: MITSUI HIGH TEC
Inventor: SAKAI NOBUO , ISHIDA KEN , IRIE JUNICHI
IPC: B65G53/60 , C23C16/44 , C23C16/455 , C23C16/458 , C23C16/54 , F04C18/344 , H01L21/673
Abstract: PROBLEM TO BE SOLVED: To surely convert the atmosphere between continued before and behind processes, while conveying at a high speed particulate matter like spherical silicon, and prevent a leak of the atmosphere, also in the case of converting the atmosphere, simplify a device constitution, so as to reduce a trouble facilitate maintenance. SOLUTION: A cylindrical rotary unit 6 provided with a recessed groove 11 opened to a peripheral surface radially in a radius direction from the center and a guide ring 3 having an elliptic sectional inner hole 5 receiving the cylindrical rotary unit 6 are provided in a housing 1, in the recessed groove 11, a vane 12 is arranged able to slide, also in the guide ring 3, in a change part from a small diametric part to a large diametric part of the inner hole 5, a first conveying atmosphere feed in pipe 16 is connected, in a continued change part from a large diametric part to a small diametric part, a first conveying atmosphere feed out pipe 17 is connected, in a continued change part from a small diametric part to a large diametric part, a second conveying atmosphere feed in pipe 18 is connected, and in a continued change part from a large diametric part to a small, diametric part, a second conveying atmosphere feed out pipe 19 is connected.
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公开(公告)号:JPH11171340A
公开(公告)日:1999-06-29
申请号:JP34348597
申请日:1997-12-12
Applicant: MITSUI HIGH TEC
Inventor: SAKAI NOBUO , ISHIDA KEN
IPC: B65G53/04 , B65G51/02 , H01L21/673 , H01L21/677 , H01L21/683 , H01L21/68
Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type conveying device for preventing spherical articles from coming into contact with a tubular inner surface, when a spherical article such as a spherical silicon-made semiconductor element is conveyed with fluid through a tubular article such as a pipe. SOLUTION: This non-contact type conveying device for spherical articles is provided with a spiral flow generating means for generating the spiral flow of fluid and introduces the fluid spiral flow generated by the spiral flow generating means to a passage for spherical articles. In this spiral flow generating means, a conveying passage 2 is provided in the axial direction, a rotatable rotary shaft 3 in which the spiral grooves 3b are provided on the specified parts on the outer peripheral surface, and an injection pipe 3a for connecting the conveying passage 2 and the spiral grooves 3b to each other is provided on the rotary shaft 3.
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公开(公告)号:JPH1148115A
公开(公告)日:1999-02-23
申请号:JP15326998
申请日:1998-06-02
Applicant: MITSUI HIGH TEC
Inventor: SAKAI NOBUO , ISHIDA KEN
IPC: B24B11/02 , B24B31/00 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a device for grinding and polishing a sphere with high grinding and polishing efficiency, and suitable for relatively easy production of the sphere of high sphericity. SOLUTION: This device is provided with a freely rotating and vertically movable rotary shaft 7 with a passing groove for a worked sphere formed into a spiral shape in its periphery, and a housing 11 arranged in an outer periphery of the shaft 7 and having a grinding and polishing surface in its inner surface. An outer circumferential surface of a sphere is ground and polished into a sphere of high sphericity during a period when the worked sphere is rotatingly moved through the passing groove 6 formed into the spiral shape in the outer periphery of the rotary shaft 7 while contacting with an inner surface of the housing 11 for grinding and polishing. This device is applicable not only for a semiconductor silicon sphere as the worked sphere but also for a steel sphere, ceramic sphere and resin sphere, the worked sphere having sizes of about 0.1 mm-10 mm can be ground and polished with high sphericity, and high sphericity within ±0.2 μm of a roundness error is attained in the case of a sphere of 1 mm diameter.
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