公开(公告)号：EP0339095A4

公开(公告)日：1990-04-10

申请号：EP88908985

申请日：1988-10-12

Applicant: MITSUI PETROCHEMICAL IND

Inventor： HASHIMOTO MICHIO ,  HARADA TAIRA ,  KISO YOSHIHISA ,  KANEKO ISAO ,  SUZUKI GOROU

IPC: C08G59/06 ,  C08G59/24 ,  C08G59/62 ,  C08J9/02 ,  C08J9/08

CPC classification number: C08J9/08 ,  C08G59/063 ,  C08G59/245 ,  C08G59/621 ,  C08J9/02 ,  C08J2363/00

Abstract: An epoxy resin which is liquid in an ordinary state is disclosed, which is obtained by reacting a bisphenolic oligocarbonate having phenolic hydroxy terminal groups with an epihalohydrin, and dehydrohalogenating the product. This resin can form tough cured products with good bending strength and bending elastic modulus. A process for producing epoxy foam is also disclosed, which comprises crosslinking a polyepoxy compound with a carbonate oligomer having phenolic hydroxy terminal groups with foaming at the same time. The obtained foam has high flexibility against compression, bending and deflection.

公开(公告)号：CA2130458A1

公开(公告)日：1994-07-07

申请号：CA2130458

申请日：1993-12-21

Applicant: MITSUI PETROCHEMICAL IND

Inventor： MORIZONO KENICHI ,  HARADA TAIRA

IPC: C08G59/14 ,  C08G59/16 ,  C09D163/00 ,  C08L63/00 ,  C09D133/00 ,  C08L33/00

Abstract: This invention relates to a resin composition for water-based coating which is a resin mixture consisting essentially of: (1) a reaction product (c) between an aromatic polyol resin (A-1) and a carboxyl group-containing acrylic resin (B); (2) an aromatic epoxy resin (D); and (3) an aromatic polyol resin (A-2), the weight ratio of component (A-1) to component (B) satisfying the following expression (I), and the proportions of components (c)/ (D) and (A-2) satisfying the following expressions (II) and (III) when the total weight of the resin mixture is 100. 85/15 ? (A-1)/(B) ? 15/85 ................... (I) 1 ? (D) + (A-2) ? 80 ........................ (II) 1 ? (D) ? 80 ................................ (III) A water-based coating composition that does not use an organic solvent is formed by dispersing the above resin composition of the invention into an aqueous medium. This water-based coating composition is excellent in stability after an elapse of time, and a coating film obtained from the composition has excellent retort resistance, adhesion to metals, processability and chemical resistance and can be cured at relatively low temperatures.

公开(公告)号：DE3161000D1

公开(公告)日：1983-11-03

申请号：DE3161000

申请日：1981-03-13

Applicant: MITSUI PETROCHEMICAL IND

Inventor： HARADA TAIRA ,  SHIMIZU TOYOZI ,  NAGAOKA TAKENORI

IPC: C07C49/76 ,  C07C45/00 ,  C07C67/00 ,  C07C209/00 ,  C07C209/62 ,  C07C211/52 ,  C07C241/00 ,  C07C251/24 ,  C07C87/60 ,  C07C119/14

公开(公告)号：JPH08319452A

公开(公告)日：1996-12-03

申请号：JP12796195

申请日：1995-05-26

Applicant: MITSUI PETROCHEMICAL IND

Inventor： HARADA TAIRA ,  ITAGAKI RYOKO

IPC: C08G59/14 ,  C08G59/18 ,  C09D5/00 ,  C09D163/00

Abstract: PURPOSE: To obtain a high-mol.-wt. epoxy resin for can coating which is excellent in thermal stability, gives a coating film excellent in processibility, adhesive properties, and corrosion resistance, and does not adversely affect the flavor of can contents by selecting a specific high-mol.-wt. epoxy resin. CONSTITUTION: This epoxy resin is represented by formula I [wherein X is C(CH3 )2 , CH(CH3 ), or CH2 ; and n is 0-1] and has the following properties: the number-average mol.wt. (by GPC) is 2,500-4,500; the ratio of the peak area (S1 ) of a component of which n=1 in the chromatogram by HPLC to the peak area (S0 ) of a component of which n=0 satisfies the relation: 0.5

公开(公告)号：JPH08319336A

公开(公告)日：1996-12-03

申请号：JP12796095

申请日：1995-05-26

Applicant: MITSUI PETROCHEMICAL IND

Inventor： HARADA TAIRA ,  ITAGAKI RYOKO

IPC: C08G59/06

Abstract: PURPOSE: To obtain a high-purity epoxy resin extremely low in the content of water-soluble impurities containing α-diols etc., suitable for e.g. electronic equipment, by bringing an epoxy resin made up of a polyhydric phenol diglycidyl ether into contact with an aqueous solution of a specific compound. CONSTITUTION: This high-purity epoxy resin is obtained by bringing (A) an epoxy resin made up of a polyhydric phenol diglycidyl ether into contact with (B) an aqueous solution of a compound selected from boric acid and its salts (e.g. lithium metaborate) pref. at 50-100 deg.C for 10-30min. The component A is obtained, in general, by ring opening addition reaction between a polyhydric phenol such as bisphenol A and epichlorohydrin in the presence of a catalyst while or followed by carrying out a ring opening with an alkali metal hydroxide. The solution B contains pref. 0.1-10 wt.% of a compound selected from boric acid and its salts, and it is preferable that the amount of the solution B to be used be 0.05-0.3wt. times the component A.

公开(公告)号：JPH08283656A

公开(公告)日：1996-10-29

申请号：JP8793095

申请日：1995-04-13

Applicant: MITSUI PETROCHEMICAL IND

Inventor： URAKAWA TOSHIYA ,  HARADA TAIRA

IPC: C08L63/00 ,  C08G59/08 ,  C08G59/20 ,  C08G59/62 ,  C09D5/03 ,  C09D163/00

Abstract: PURPOSE: To obtain an solid epoxy resin composition for rapidly curable powder coating giving excellent coated membrane performance, even when the backing time is short, and also superior in shock resistance by allowing a specific bisphenolic epoxy resin to react with bisphenolic compounds and a bisphenol A novolak epoxy resin. CONSTITUTION: (A) A bisphenol-A epoxy resin of formula I (R and R are each H, methyl; n is an integer of 0-6), (B) bisphenol compounds of formula II (R and R are each H, methyl, ethyl, butyl) and (C) a bisphenol A novolak and epoxy resin obtained by reaction of (i) a bisphenol A novolak resin of 100-300g/eq prepared by reaction of bisphenol A and formaldehyde in the presence of an acid catalyst with (ii) an epihalohydrin are made to react. This reaction is preferably carried out at 100-180 deg.C for 2-12 hours in a weight proportion of A:B:C=(0-500):(100-500):(10-500).

公开(公告)号：JPH04293932A

公开(公告)日：1992-10-19

申请号：JP5921191

申请日：1991-03-22

Applicant: MITSUI PETROCHEMICAL IND

Inventor： MORISONO KENICHI ,  HARADA TAIRA

IPC: C08G81/02 ,  C09D5/00 ,  C09D5/02 ,  C09D5/08 ,  C09D167/00 ,  C09D187/00

Abstract: PURPOSE:To obtain an aqueous dispersion excelling in long-term stability and giving a coating film excellent in retort resistance, adhesion to metal and processability by neutralizing the carboxyl groups of a specified esterification product and finely dispersing the neutralized product in water. CONSTITUTION:At least part of the carboxyl groups of an esterification product of the primary hydroxyl groups of an aromatic polyol resin (desirably one having a numberaverage molecular weight of 350-40000, 0-0.4 epoxy group and 0.01-1.0 primary hydroxyl group on the average per molecule having the carboxyl groups of a carboxy acrylic resin (desirably one having a number- average molecular weight of 300-60000, at least 25wt.% carboxylic acid units and an acid value of 25-450) are neutralized with a basic compound, and the neutralization product is finely dispersed in water. An aqueous dispersion of a coating composition excelling in long-term stability, forming a coating film capable of being cured at low temperatures and giving a cured film excellent in adhesion to a metallic substrate and processability can be obtained.

公开(公告)号：JPH02175714A

公开(公告)日：1990-07-09

申请号：JP33251888

申请日：1988-12-28

Applicant: MITSUI PETROCHEMICAL IND

Inventor： MORISONO KENICHI ,  HARADA TAIRA

IPC: C08G59/06

Abstract: PURPOSE:To reduce the hydrolyzable chlorine content and to prevent a gel-like substance from forming as a by-product by subjecting the hydrolyzable chlorine in a crude polyphenol epoxy resin again to ring closure. CONSTITUTION:A polyphenol (e.g. bisphenol A) and an epihalohydrin are subjected successively to ring opening and dehydrohalogenation in the presence of an alkali metal hydroxide and/or a catalyst to obtain a crude polyphenol epoxy resin of a hydrolyzable chlorine content of 0.1-5.0wt.%. This epoxy resin is washed with water at room temperature to 100 deg.C until the total content of the water-soluble organic compounds to be removed is reduced to 1.2g/kg of the formed resin, brought into contact with an aqueous solution containing 1-30wt.% alkali hydroxide in an amount 1-10 times as large as that of the remaining hydrolyzable chlorine atoms in the crude epoxy resin and subjected to ring closure again at 50-150 deg.C to obtain a polyphenol epoxy resin of a hydrolyzable chlorine content

公开(公告)号：JPH01221342A

公开(公告)日：1989-09-04

申请号：JP4693688

申请日：1988-02-29

Applicant: MITSUI PETROCHEMICAL IND

Inventor： UEKI HIROMI ,  ISHIMARU ETSUJI ,  HARADA TAIRA

IPC: C07D317/72 ,  C07C41/00 ,  C07C41/03 ,  C07C43/23 ,  C07C67/00 ,  C08G59/62 ,  C08G63/12 ,  C08G63/20 ,  C08G63/66 ,  C08G64/00

Abstract: NEW MATERIAL:The compound of formula II (Y is H, benzyl, 2,3- dihydroxypropyl, hydrocarbon group or lower alkyl having spiran ring; Z is same as Y excluding H and benzyl; n is 1-3). EXAMPLE:1-(4-Hydroxyphenoxy)-3-[4-(2,3-dihydroxy-1-propanoxy)phenoxy]-2- propanol. USE:A constituent component for polyester resin, alkyd resin, etc. It has excellent compatibility with polyester resin and gives an alkyd resin, polyester resin, etc., having excellent adhesivity, gas-barrierness, water-resistance, heat-resistance, etc. PREPARATION:A compound of formula II wherein Y is benzyl, Z is 2,3- dihydroxypropyl and n is 1 can be produced by reacting the compound of formula I with the compound of formula III in a solvent in the presence of a catalyst under heating. The catalytic hydrocracking of the obtained compound gives another compound of formula II wherein Y is H.

公开(公告)号：JPH01144444A

公开(公告)日：1989-06-06

申请号：JP30389187

申请日：1987-11-30

Applicant: MITSUI PETROCHEMICAL IND

Inventor： HARADA TAIRA

IPC: C08G59/14 ,  C08G59/00 ,  C08G59/62 ,  C08L63/00

Abstract: PURPOSE:To obtain the title composition, rapidly curable even without increasing the amount of a curing accelerator and capable of providing cured products having improved heat resistance, by reacting a blend of respective specific three kinds of epoxy resins with (tetrabromo)bisphenols. CONSTITUTION:The aimed composition obtained by adding and reacting bisphenols and/or tetrabromobisphenols with a blend consisting of preferably 1-15wt.% epoxy resin, prepared by reacting hydroquinone with epichlorohydrin and consisting essentially of a hydroquinone type diglycidyl ether, preferably 20-98wt.% epoxy resin, obtained by reacting bisphenols with epichlorohydrin and consisting essentially of a bisphenol type diglycidyl ether and preferably 1-30wt.% epoxy resin, prepared by reacting novolaks with epichlorohydrin and consisting essentially of a novolak type polyglycidyl ether.