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    PROCESS FOR PREPARING 2-UNSUBSTITUTED IMIDAZOLES.
    1.
    发明公开
    PROCESS FOR PREPARING 2-UNSUBSTITUTED IMIDAZOLES. 失效
    方法生产2-未取代的咪唑。

    公开(公告)号：EP0252162A4

    公开(公告)日：1988-07-29

    申请号：EP87901109

    申请日：1987-01-28

    Applicant: MITSUI PETROCHEMICAL IND

    Inventor： YAMAMOTO SANEHIRO ,  YASUHARA MITSUKI ,  MATSUNAGA FUJIHISA ,  OKANO MASATO ,  NAKAMURA MITSUNORI

    IPC: C07D233/54 ,  C07D233/58

    CPC classification number: C07D233/56 ,  C07D233/64

    Abstract: A process for preparing 2-unsubstituted imidazoles, which comprises reacting an alpha-hydroxycarbonyl compound with a formamide in a molar ratio of the formamide to the hydroxycarbonyl compound of 2 or less at a reaction temperature of 100 to 170°C in an atmosphere of ammonia gas. This process makes it possible to obtain 2-unsubstituted imidazoles in an extremely high yield and provides an advantage that recovering procedures involving decomposition of the formamide can be eliminated since it is not used in large excess. Removal of formic acid formed as by-product of the reaction serves to prevent corrosion of reactors and separators such as a distilling tower and yield highly pure imidazoles.

    3.
    发明专利
    未知

    公开(公告)号：DE69124937T2

    公开(公告)日：1997-07-24

    申请号：DE69124937

    申请日：1991-11-29

    Applicant: MITSUI PETROCHEMICAL IND ,  YAZAKI CORP

    Inventor： AMIMOTO YOSHIKATSU ,  IKEJIRI FUMITOSHI ,  YAMAMOTO SANEHIRO ,  TOYOTA AKINORI ,  NISHIMURA KATUNARI ,  KANDA MASAHIRO ,  KATO TETSUO

    IPC: C08K5/49 ,  C08L51/06 ,  C08K5/524 ,  C08L77/00 ,  C08L77/06 ,  H01R13/46

    Abstract: Disclosed is a thermoplastic resin composition comprising (A) an aromatic polyamide comprising dicarboxylic acid units comprising 50-100 mol% of units derived from terephthalic acid, and 0-50 mol% of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic dicarboxylic acid having 4-20 carbon atoms, and diamine units derived from an aliphatic diamine and/or an alicyclic diamine, said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30 DEG C and a melting point of higher than 300 DEG C, (B) a graft modified alpha -olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and (C) an aliphatic polyamide, wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified alpha -olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A). n

    POLYAMIDE RESIN COMPOSITION AND CONNECTOR
    4.
    发明专利
    POLYAMIDE RESIN COMPOSITION AND CONNECTOR 未知

    公开(公告)号：CA2091963C

    公开(公告)日：2000-01-18

    申请号：CA2091963

    申请日：1993-03-18

    Applicant: YAZAKI CORP ,  MITSUI PETROCHEMICAL IND

    Inventor： YAMAMOTO SANEHIRO ,  SUGIYAMA KAZUTO ,  TOYOTA AKINORI ,  AMIMOTO YOSHIKATSU ,  IKEJIRI FUMITOSHI ,  KATO TETSUO ,  KANDA MASAHIRO

    IPC: C08K5/13 ,  C08K5/36 ,  C08K5/372 ,  C08L23/26 ,  C08L77/00 ,  C08L77/06 ,  C08L77/10 ,  H01B3/30 ,  H01R13/46 ,  C08L33/02 ,  C08L51/06 ,  C08L51/08

    Abstract: The resin composition of the invention comprises as resin components specific aromatic polyamide (A) in an amount of 50 to 85 o by weight, a specific graft-modified polymer (B) in an amount of 10 to 40 % by weight and aliphatic polyamide (C) in an amount of 1 to 15 % by weight, and further comprises plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10 % weight loss temperature of not lower than 300 .degree.C and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10 o weight loss temperature of not lower than 280 .degree.C. In this resin composition, the total amount of (D) and (E) is in the range of 0.2 to 4 parts by weight per 100 parts by weight of the resin components, and a weight ratio between (D) and (E) is in-the range of 1 : 5 to 5 . 1. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.

    RESIN MOLDED ARTICLES FOR FORMING PLATED LAYER AND USE THEREOF
    5.
    发明专利
    RESIN MOLDED ARTICLES FOR FORMING PLATED LAYER AND USE THEREOF 未知

    公开(公告)号：CA2020606C

    公开(公告)日：1998-05-12

    申请号：CA2020606

    申请日：1990-07-06

    Applicant: MITSUI PETROCHEMICAL IND

    Inventor： YAMAMOTO SANEHIRO ,  IKEJIRI FUMITOSHI ,  KAWAMOTO KEIJI

    IPC: C08K3/00 ,  H05K1/03 ,  H05K9/00 ,  C08L77/06 ,  C23C28/02 ,  C25D5/56

    Abstract: The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.

    6.
    发明专利
    未知

    公开(公告)号：ES2100923T3

    公开(公告)日：1997-07-01

    申请号：ES91120460

    申请日：1991-11-29

    Applicant: MITSUI PETROCHEMICAL IND ,  YAZAKI CORP

    Inventor： AMIMOTO YOSHIKATSU ,  IKEJIRI FUMITOSHI ,  YAMAMOTO SANEHIRO ,  TOYOTA AKINORI ,  NISHIMURA KATUNARI ,  KANDA MASAHIRO

    IPC: C08K5/49 ,  C08L51/06 ,  C08K5/524 ,  C08L77/00 ,  C08L77/06 ,  H01R13/46

    Abstract: Disclosed is a thermoplastic resin composition comprising (A) an aromatic polyamide comprising dicarboxylic acid units comprising 50-100 mol% of units derived from terephthalic acid, and 0-50 mol% of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic dicarboxylic acid having 4-20 carbon atoms, and diamine units derived from an aliphatic diamine and/or an alicyclic diamine, said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30 DEG C and a melting point of higher than 300 DEG C, (B) a graft modified alpha -olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and (C) an aliphatic polyamide, wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified alpha -olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A). n

    7.
    发明专利
    未知

    公开(公告)号：DE69124937D1

    公开(公告)日：1997-04-10

    申请号：DE69124937

    申请日：1991-11-29

    Applicant: MITSUI PETROCHEMICAL IND ,  YAZAKI CORP

    Inventor： AMIMOTO YOSHIKATSU ,  IKEJIRI FUMITOSHI ,  YAMAMOTO SANEHIRO ,  TOYOTA AKINORI ,  NISHIMURA KATUNARI ,  KANDA MASAHIRO ,  KATO TETSUO

    IPC: C08K5/49 ,  C08L51/06 ,  C08K5/524 ,  C08L77/00 ,  C08L77/06 ,  H01R13/46

    Abstract: Disclosed is a thermoplastic resin composition comprising (A) an aromatic polyamide comprising dicarboxylic acid units comprising 50-100 mol% of units derived from terephthalic acid, and 0-50 mol% of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic dicarboxylic acid having 4-20 carbon atoms, and diamine units derived from an aliphatic diamine and/or an alicyclic diamine, said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30 DEG C and a melting point of higher than 300 DEG C, (B) a graft modified alpha -olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and (C) an aliphatic polyamide, wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified alpha -olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A). n

    9.
    发明专利
    未知

    公开(公告)号：FR2734989B1

    公开(公告)日：1999-08-27

    申请号：FR9607038

    申请日：1996-06-07

    Applicant: MITSUI PETROCHEMICAL IND

    Inventor： YAMAMOTO SANEHIRO ,  OHE TATSUYA

    IPC: A01G9/14 ,  B32B27/32 ,  C08J5/18 ,  C08K5/103 ,  C08L23/06 ,  C08L23/08 ,  B32B27/28 ,  B32B27/08 ,  C08L23/04 ,  C08K5/00

    Abstract: A monolayer film, for agricultural use, consists of a layer made from an ethylene co-polymer (I) comprising: 100 pts. wt. co-polymer (A) of ethylene and a 4-12C alpha -olefin which has a density of 0.905-0.935 g/cm and a melt flow index (hot) of 0.1-10g/10 min. or 100 pts. wt. of a mixt. of (A) and at most 40 wt.% low density (at high pressure) polyethylene (B) and 100 pts. wt. of an anti-misting agent (C). (A), or the mixt. of (A) and (B) have the following properties: (i) polymolecularity index = 1.5 - 3.5 (ii) proportion in wt.% (W) of components soluble in n-decane at 23 deg C and density, d, satisfies the relationship: W

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