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公开(公告)号:DE69110515D1
公开(公告)日:1995-07-27
申请号:DE69110515
申请日:1991-03-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KITAMURA TADASHI , DOI KIYOTO , KAWASAKI EIICHI , YASHIRO KENICHI
IPC: C09J151/00 , C09J157/06 , C09J201/02 , E04C2/08
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公开(公告)号:DE69222990D1
公开(公告)日:1997-12-11
申请号:DE69222990
申请日:1992-07-17
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KAWASAKI EIICHI , DOI KIYOTO , KITAMURA TADASHI , SUEWAKA KOUSUKE
IPC: C08G18/10 , C08G18/62 , C08G18/72 , C08L51/00 , C09J151/00 , C09J151/06 , C09J175/00 , C08G18/81 , C09J175/06
Abstract: There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 20,000 of number-average molecular weight, and low-molecular-weight polymer having at least one isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives or reactive hot melt type pressure-sensitive adhesives coating material which can be omitted hot press process.
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公开(公告)号:DE3131364A1
公开(公告)日:1982-08-19
申请号:DE3131364
申请日:1981-08-07
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KITAMURA TADASHI , HIROSE SUMIO
IPC: C08K13/02 , C09D5/24 , H01B1/22 , H05K1/09 , C08K3/08 , C08K3/10 , C08K5/13 , C09D5/38 , C09J3/00 , H01L49/02 , H01L27/01 , H05K3/00 , C09D11/10
Abstract: Conductive cured products which have superior initial conductivity which is substantially retained even under high temperature and humidity conditions are obtained by curing a resinous composition comprising (a) a metallic copper powder, (b) a copper compound, (c) a compound having a 1,4-dihydroxy benzene ring or 1,2-dihydroxy benzene ring structure, and (d) a resinous curable component. Additionally, inclusion of a chelate forming compound in the uncured composition prevents a curing phenomenon on the surface of the composition during storage. The compound having the dihydroxy benzene ring (compound c) reduces the copper compound (b) to deposit metallic copper, and the resinous curable component integrates the constituents into a conductive product upon curing. The compositions are used as paints, adhesives, printing inks, and moulded articles, and they are useful in the electric, electronic, automobile, and housing fields.
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公开(公告)号:SG49033A1
公开(公告)日:1998-05-18
申请号:SG1996005381
申请日:1992-07-17
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KAWASAKI EIICHI , DOI KIYOTO , KITAMURA TADASHI , SUEWAKA KOUSUKE
IPC: C09J3/14
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公开(公告)号:DE69222990T2
公开(公告)日:1998-06-25
申请号:DE69222990
申请日:1992-07-17
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KAWASAKI EIICHI , DOI KIYOTO , KITAMURA TADASHI , SUEWAKA KOUSUKE
IPC: C08G18/10 , C08G18/62 , C08G18/72 , C08L51/00 , C09J151/00 , C09J151/06 , C09J175/00 , C08G18/81 , C09J175/06
Abstract: There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 20,000 of number-average molecular weight, and low-molecular-weight polymer having at least one isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives or reactive hot melt type pressure-sensitive adhesives coating material which can be omitted hot press process.
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公开(公告)号:DE2334825A1
公开(公告)日:1974-01-31
申请号:DE2334825
申请日:1973-07-09
Applicant: MITSUI TOATSU CHEMICALS
Inventor: MOMOTARI YOSHITAKA , HARA ZUNJI , KITAMURA TADASHI
IPC: C08F2/00 , C08F2/02 , C08F2/44 , C08F283/01 , C08F299/00 , C08K5/5415 , C09D4/00 , C09D167/06 , C09J3/00
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公开(公告)号:DE69110515T2
公开(公告)日:1996-02-15
申请号:DE69110515
申请日:1991-03-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KITAMURA TADASHI , DOI KIYOTO , KAWASAKI EIICHI , YASHIRO KENICHI
IPC: C09J151/00 , C09J157/06 , C09J201/02 , E04C2/08
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公开(公告)号:DE2623695A1
公开(公告)日:1977-12-08
申请号:DE2623695
申请日:1976-05-26
Applicant: MITSUI TOATSU CHEMICALS
Inventor: MOMOTARI YOSHITAKA , HARA JUNJI , KITAMURA TADASHI , IYAMA SHIGEO
Abstract: Conductive hardened prod. mfr. involves reacting a Cu cpd. (I) with a reducing agent (II), which can reduce (I) to Cu in the presence of Cu powder on a substrate, so that a conductive bound unit of Cu powder is formed, and subjecting this to hardening-forming with a hardenable resinous compsn., so that the constituents are integrated to a conductive hardened prod. Used for producing electric circuits and heating circuits, filling galvanised perforations, fixing components, vehicle window de-icing circuits, FM receiving attanae, domestic heating circuits and window burglar alarm circuits. The prods. have good initial and long-term conductivity and can be formed at low temp.
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公开(公告)号:JPH06298921A
公开(公告)日:1994-10-25
申请号:JP8770193
申请日:1993-04-15
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KITAMURA TADASHI , AJIOKA MASANOBU , SHINODA KAZUYA
IPC: C08F299/02 , C08F290/00 , C08F299/04 , C08G63/52 , C08G63/91 , C08L101/16
Abstract: PURPOSE:To provide a macromonomer having excellent microbial degradability and alkali hydrolizability and useful as a polymer alloy-forming agent and solubilization assistant for polymeric materials by compounding a lactic acid- based resin and a low-molecular weight monomer having a specific structure. CONSTITUTION:The macromonomer is composed of (A) a resin having a weight- average molecular weight of 1,000-50,000 and selected from (i) a polylactic acid derived from lactic acid and/or a cyclic lactide, (ii) a lactic acid random copolymer resin derived from lactic acid and/or a cyclic lactide and a mercaptocarboxylic acid and (iii) a lactic acid block copolymer resin derived from polylactic acid and a polymercaptocarboxylic acid, etc., and having a lactic acid content of 30-95wt.% and (B) a low-molecular weight monomer having a molecular weight of
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公开(公告)号:JPH06192636A
公开(公告)日:1994-07-12
申请号:JP34633692
申请日:1992-12-25
Applicant: MITSUI TOATSU CHEMICALS
Inventor: KAWASAKI EIICHI , SHINODA KAZUYA , KITAMURA TADASHI , YASHIRO KENICHI , UEWAKA KOUSUKE
IPC: C09J131/04 , C08G18/72 , C09J151/00 , C09J201/00 , C09J201/02
Abstract: PURPOSE:To obtain a compsn. which is nonsticky at room temp. before curing and exhibits a high curing rate in contact with moisture by mixing a specific high-molecular graft copolymer, a low-molecular polymer, and a wax. CONSTITUTION:The compsn. is prepd. by mixing 10-90wt. % graft copolymer which has a number-average mol.wt. of 10,000-200,000 and is obtd. by copolymerizing a monomer having vinyl and isocyanate groups in the molecule and/or a monomer having a vinyl group and an active silyl group of the formula (wherein X is alkoxy or acetoxy; Y is Cl or 1-5C alkyl; and n is 0-2), a vinyl- terminated macromonomer having a number-average mol.wt. of 2,000 or higher and a glass transition point of 20 deg.C or higher, and a 1-12C alkyl (meth)acrylate with 90-10wt.% vinyl acetate/alkyl acrylate copolymer having a number-average mol.wt. of 500-8,000 and mixing 100 pts.wt. resulting resin mixture with 1-35 pts.wt. wax having an m.p. of 50-150 deg.C.
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