3.
    发明专利
    未知

    公开(公告)号:DE3131364A1

    公开(公告)日:1982-08-19

    申请号:DE3131364

    申请日:1981-08-07

    Abstract: Conductive cured products which have superior initial conductivity which is substantially retained even under high temperature and humidity conditions are obtained by curing a resinous composition comprising (a) a metallic copper powder, (b) a copper compound, (c) a compound having a 1,4-dihydroxy benzene ring or 1,2-dihydroxy benzene ring structure, and (d) a resinous curable component. Additionally, inclusion of a chelate forming compound in the uncured composition prevents a curing phenomenon on the surface of the composition during storage. The compound having the dihydroxy benzene ring (compound c) reduces the copper compound (b) to deposit metallic copper, and the resinous curable component integrates the constituents into a conductive product upon curing. The compositions are used as paints, adhesives, printing inks, and moulded articles, and they are useful in the electric, electronic, automobile, and housing fields.

    MACROMONOMER AND ITS POLYMER
    9.
    发明专利

    公开(公告)号:JPH06298921A

    公开(公告)日:1994-10-25

    申请号:JP8770193

    申请日:1993-04-15

    Abstract: PURPOSE:To provide a macromonomer having excellent microbial degradability and alkali hydrolizability and useful as a polymer alloy-forming agent and solubilization assistant for polymeric materials by compounding a lactic acid- based resin and a low-molecular weight monomer having a specific structure. CONSTITUTION:The macromonomer is composed of (A) a resin having a weight- average molecular weight of 1,000-50,000 and selected from (i) a polylactic acid derived from lactic acid and/or a cyclic lactide, (ii) a lactic acid random copolymer resin derived from lactic acid and/or a cyclic lactide and a mercaptocarboxylic acid and (iii) a lactic acid block copolymer resin derived from polylactic acid and a polymercaptocarboxylic acid, etc., and having a lactic acid content of 30-95wt.% and (B) a low-molecular weight monomer having a molecular weight of

    REACTIVE HOT-MELT ADHESIVE COMPOSITION

    公开(公告)号:JPH06192636A

    公开(公告)日:1994-07-12

    申请号:JP34633692

    申请日:1992-12-25

    Abstract: PURPOSE:To obtain a compsn. which is nonsticky at room temp. before curing and exhibits a high curing rate in contact with moisture by mixing a specific high-molecular graft copolymer, a low-molecular polymer, and a wax. CONSTITUTION:The compsn. is prepd. by mixing 10-90wt. % graft copolymer which has a number-average mol.wt. of 10,000-200,000 and is obtd. by copolymerizing a monomer having vinyl and isocyanate groups in the molecule and/or a monomer having a vinyl group and an active silyl group of the formula (wherein X is alkoxy or acetoxy; Y is Cl or 1-5C alkyl; and n is 0-2), a vinyl- terminated macromonomer having a number-average mol.wt. of 2,000 or higher and a glass transition point of 20 deg.C or higher, and a 1-12C alkyl (meth)acrylate with 90-10wt.% vinyl acetate/alkyl acrylate copolymer having a number-average mol.wt. of 500-8,000 and mixing 100 pts.wt. resulting resin mixture with 1-35 pts.wt. wax having an m.p. of 50-150 deg.C.

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