公开(公告)号：BR8108966A

公开(公告)日：1983-01-11

申请号：BR8108966

申请日：1981-12-14

Applicant: MOTOROLA INC

Inventor： ELLSWORTH KENNETH A

IPC: H01L21/58 ,  H01L23/051 ,  H01L23/31 ,  H01L23/28 ,  H01L23/02 ,  H01L23/12 ,  H01L23/42

公开(公告)号：IT1147575B

公开(公告)日：1986-11-19

申请号：IT4754882

申请日：1982-01-13

Applicant: MOTOROLA INC

Inventor： ELLSWORTH KENNETH A

IPC: H01L21/58 ,  H01L23/051 ,  H01L23/31 ,  H01L

公开(公告)号：CA1177580A

公开(公告)日：1984-11-06

申请号：CA393799

申请日：1982-01-08

Applicant: MOTOROLA INC

Inventor： ADDIE DAVID L ,  ELLSWORTH KENNETH A

IPC: H01L21/60 ,  H01L23/051 ,  H05K1/02

Abstract: BUTTON RECTIFIER PACKAGE FOR NON-PLANAR DIE An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die to planar mounting surfaces is achieved.

公开(公告)号：BR8108967A

公开(公告)日：1983-01-11

申请号：BR8108967

申请日：1981-12-21

Applicant: MOTOROLA INC

Inventor： ADDIE DAVID L ,  ELLSWORTH KENNETH A

IPC: H01L21/60 ,  H01L23/051 ,  H01L23/48 ,  H01L29/46

公开(公告)号：IT8247548D0

公开(公告)日：1982-01-13

申请号：IT4754882

申请日：1982-01-13

Applicant: MOTOROLA INC

Inventor： ELLSWORTH KENNETH A

IPC: H01L21/58 ,  H01L23/051 ,  H01L23/31 ,  H01L

公开(公告)号：EP0070862A4

公开(公告)日：1985-04-25

申请号：EP82900484

申请日：1981-12-21

Applicant: MOTOROLA INC

Inventor： ADDIE DAVID L ,  ELLSWORTH KENNETH A

IPC: H01L21/60 ,  H01L23/051 ,  H01L23/48 ,  H01L23/02 ,  H01L23/28 ,  H01L23/42 ,  H01L29/46

CPC classification number: H01L24/83 ,  H01L23/051 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/32014 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/12043 ,  H01L2924/3011 ,  H01L2924/0133 ,  H01L2924/01049 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Axial lead semiconductor device package (30) for use with non-planar semiconductor die (23). By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die (23) to planar mounting surfaces (36) is achieved.

公开(公告)号：WO1982002798A1

公开(公告)日：1982-08-19

申请号：PCT/US1981001731

申请日：1981-12-21

Applicant: MOTOROLA INC

Inventor： MOTOROLA INC ,  ADDIE DAVID L ,  ELLSWORTH KENNETH A

IPC: H01L23/48

CPC classification number: H01L24/83 ,  H01L23/051 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/32014 ,  H01L2224/8319 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/12043 ,  H01L2924/3011 ,  H01L2924/0133 ,  H01L2924/01049 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Axial lead semiconductor device package (30) for use with non-planar semiconductor die (23). By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die (23) to planar mounting surfaces (36) is achieved.

Abstract translation: 用于非平面半导体管芯（23）的轴向引线半导体器件封装（30）。 通过使用具有预定强度，润湿和流动特性，熔化温度，形状，面积和厚度的焊料，实现非平面模具（23）到平面安装表面（36）的可靠附接。

公开(公告)号：WO1982002797A1

公开(公告)日：1982-08-19

申请号：PCT/US1981001657

申请日：1981-12-14

Applicant: MOTOROLA INC

Inventor： MOTOROLA INC ,  ELLSWORTH KENNETH A

IPC: H01L23/28

CPC classification number: H01L23/3107 ,  H01L23/051 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An axial lead package (20) meeting existing dimensional standards is provided with internal pedestals (22, 24) each having a cross-sectional area more than one and one half times the area of the post (21, 32).

Abstract translation: 符合现有尺寸标准的轴向引线封装（20）设置有内部基座（22,24），每个基座的横截面面积大于支柱（21,32）面积的一倍以上。